Aculon Inc.

General Electric Company

Donald Cunningham

Christopher James Kapusta

Eric L Hanson

Eric L Bruner

Richard Joseph Saia

Coated electronic components of a circuit assembly are provided, comprising: one or more lead frames, one or more chips, connection wires, a moisture barrier coating layer, and an encapsulating plastic coating layer. The moisture barrier coating layer may be applied to the electronic component with the encapsulating plastic coating layer applied on top of the moisture barrier coating layer, or vice versa; such that only lead frames are exposed. Also provided are electronic components of a circuit assembly, comprising: one or more lead frames, one or more chips, connection wires, one or more leads extending from the coated electronic component, a moisture barrier coating layer, and an encapsulating plastic coating layer. The encapsulating plastic coating layer is applied to the electronic component and the moisture barrier coating layer is applied on top of the entire encapsulating plastic coating layer on all sides, such that only the leads are exposed.

Growing community of inventors

Dallas, TX, United States of America

Donald Cunningham