Corning Incorporated

Donald Arthur Clark

Gregory Scott Glaesemann

Sean Matthew Garner

Charles Donahue Rizzolo

Pascale Oram

Jun Hou

Richard Curwood Peterson

Kathleen Ann Wexell

Jennifer Lynn Lyon

Toshihiko Ono

Gregory William Keyes

Shyamala Shanmugam

Daniel Arthur Sternquist

Christopher Clark Thompson

Jeanne Spadinger Cavuoti

Jum Sik Kim

Oladapo Olalekan Bello

Kody Luce Bornstein

Krishna Hemanth Vepakomma

Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 &#x3bc;m to about 150 &#x3bc;m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/mproviding for a flat fragmentation factor of less than or equal to 5.

Carriers for microelectronics fabrication

Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Method of strengthening an edge of a glass substrate

Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as NaO, KO and LiO.

Surface flaw modification for strengthening of glass articles

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Corning, NY, United States of America

Donald Arthur Clark