Johnson Matthey Inc.

Donald A Burkhart

Michael M Chau

A composition suitable for use as an underfill for an interconnection between a semiconductor device and a substrate, as a semiconductor device encapsulant, a dam, an adhesive for direct chip attachment, and as an electrical connection for semiconductor device and a substrate. The composition contains about 40 to 90 wt. % of an electrically conductive or non-conductive filler and a cyanate ester and epoxy resin component. The cyanate ester/epoxy resin component comprises about 10 to 70 wt. % cyanate ester material, about 30 to 90 wt. % of epoxy resin, about 0.1 to 1.5 wt. % metal chelate/amine solid curing catalyst and about 0.1 to 5 wt. % of a coupling agent.

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San Diego, CA, United States of America

Donald A Burkhart