Intel Corporation

Don W Nelson

Johanna M Swan

Adel A Elsherbini

Feras Eid

Patrick R Morrow

Henning Braunisch

Kimin Jun

Il-Seok Son

M Clair Webb

An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.

Dual-sided die packages

Methods of forming microelectronic interconnect under device structures are described. Those methods and structures may include forming a device layer in a first substrate, forming at least one routing layer in a second substrate, and then coupling the first substrate with the second substrate, wherein the first substrate is bonded to the second substrate.

Methods of forming under device interconnect structures

Growing community of inventors

Beaverton, OR, United States of America

Don W Nelson