Hewlett-packard Development Company, L.p.

Don P Williams

David N Skinner

Peter K Lee

A method and system of cooling components of a computer system. At least some of the illustrative embodiments are computer systems comprising an enclosure, a motherboard within the enclosure, a heat generating component coupled to the motherboard and within the enclosure, a canister comprising a compressed fluid (the canister coupled to the enclosure), and a gas cooling device selectively fluidly coupled to the compressed fluid (the gas cooling device produces chilled gas when fluidly coupled to the compressed fluid). The chilled gas is directed upon the heat generating component.

Method and system of cooling components of a computer system

A stand for a computing system includes a first panel, a second panel, and a third panel. The first panel, second panel, and third panel may be pivoted to provide support in a low-angle orientation, a high-angle orientation, and a flat orientation.

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Campbell, CA, United States of America

Don P Williams