Nvidia Corporation

Don Le

Barry A Wagner

William Tsu

Jeong Hun Kim

Zhihai Zack Yu

Xiaohua H Sun

Samuel Abbay

A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

Heat transfer system, method, and computer program product for use with multiple circuit board environments

A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.

Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder

The present invention pertains to a computer chassis with improved airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition. The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.

Computer chassis with partitions for improved airflow

Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of the present invention, the chassis comprises at least one air inlet disposed on a side of the chassis and at least one exhaust outlet disposed on the bottom surface of the chassis. The heat generating component is suspended from said backplane when coupled therewith and is disposed above the at least one exhaust outlet. The fan draws cooling air through the at least one air inlet and expels the cooling air through the at least one exhaust outlet.

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San Jose, CA, United States of America

Don Le