International Business Machines Corporation

Don L Baker

Glenn David Gilda

Dean W Skinner

Bahgat Ghaleb Sammakia

Joseph Funari

Randall Joseph Stutzman

Hussain Shaukatullah

William Fred Otto

Terrence A Quinn

An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a base member of the package. In one embodiment, a singular heat sink member is thermally coupled to a respective one of the semiconductor devices, and a common, second heat sink member is thermally coupled to all of the first heat sink members. This common heat sink member also uniquely serves as a stiffener for the package. In another embodiment, a common heat sink member is securedly positioned on the opposite side of a first circuitized substrate from the plurality of flexible circuitized substrates and semiconductor devices. A base member is also used as part of this package. As in the aforementioned other embodiment, the common heat sink member also serves as a stiffener.

Electronic assembly with enhanced heat sinking

A portable thermocouple template is built to have one or more separate thermocouple beads fixedly attached at predetermined locations on a thin insulator sheet, with appropriate tape or the like for holding each thermocouple and its pair of connector wires in position on the sheet. The template is mountable between interconnected electronic components, such as on the pin side of a multichip module, in order to monitor the temperature of the adjacent components under actual operating conditions. After the test is completed and the temperature data is recorded and/or displayed on a data logger, the template and related assembly wires are removed and stored until such time as the template is needed for mounting again in order for additional thermal tests to be conducted.

Removable thermocouple template for monitoring temperature of multichip

In an ink jet serial printer, a drop collector has horizontal and vertical collector sections or gutters. Unused drops are diverted in the direction of motion during uniform velocity of the ink jet head into the vertical section and into the horizontal section during acceleration/deceleration portions of head motion. A bias potential applied to the vertical drop deflector is removed during acceleration/deceleration to cause unused drops to be directed to the horizontal collector section.

Ink jet line printer

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Johnson City, NY, United States of America

Don L Baker