Other

Hewlett-packard Development Company, L.P.

Hewlett-packard Company

Don E Saunders

Gabe Cherian

Stewart R Wyatt

Cameron Hutchings

Richard M Wilson

Scott David Hahn

According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer. The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material. In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.

Printed circuit board

Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

TFCC (TM) and SWCC (TM) thermal flex contact carriers

A structure for mounting a circuit card. The structure includes a track in which the circuit card may slide and pivot. The card slides into the track and then pivots to engage electrical contacts on the body of the circuit card, rather than on the edge of the card, to mating contacts on the main circuit board in the computer, printer or other electronic device.

Structure for mounting and method for installing a circuit card

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Boise, ID, United States of America

Don E Saunders