Samsung Electro-mechanics Co., Ltd.

Don Chul Choi

Sang Soo Park

Dong Hwan Lee

Hee Soo Yoon

Jae Cheol Ju

Hee-Soo Yoon

Dong-Hwan Lee

Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.

Printed circuit board having embedded RF module power stage circuit

A method for producing a multilayer substrate includes stacking a first substrate, the first substrate having a circuit pattern; stacking a connector, the connector coupling onto said first substrate, the connector having a ring structure, the ring structure having a plurality of holes separated a predetermined distance from one another; and stacking a second substrate, the second substrate coupling onto said first substrate by inserting said connector, the second substrate having a circuit pattern, the circuit pattern being electrically connected to a circuit pattern formed on said first substrate, the circuit pattern being electrically connected using the plurality of holes formed on said connector. The method of producing a multilayer substrate can shield the EMI generated by a high-speed switching element.

Multilayer substrate manufacturing method

A multilayer substrate, comprising a first substrate, a connector and a second substrate, is disclosed. The first substrate has a circuit pattern. The connector, coupling onto the first substrate, has a ring structure, in which a plurality of holes are separated a predetermined distance from one another. The second substrate, coupling onto the second substrate by inserting the connector, has a circuit pattern, which is electrically connected to a circuit pattern formed on the first substrate using the plurality of holes formed on the connector. A multilayer substrate and a method for producing it in accordance with the present invention can shield the EMI generated by a high-speed switching element.

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Incheon, South Korea

Don Chul Choi