International Business Machines Corporation

Don Alan Gilliland

Edward Charles Gillard

Dennis James Wurth

Ross Thomas Fredericksen

Cary Huettner

James L Peacock

David B Johnson

Max John Christopher Koschmeder

Scott Lee Christopherson

Maurice Francis Holahan

Amanda Elisa Ennis Mikhail

Andrew James Frana

Joseph Paul Kuczynski

Matthew Allen Butterbaugh

Jessica Rose Berens

Matthew Carl Zehrer

Thomas J McPhee, Iii

Sophia S Lau

Matthew Stephen Doyle

Phillip V Mann

Roger Allen Booth, Jr

Thomas W Liang

Mark James Jeanson

Patrick Kevin Egan

John Lee Colbert

Scott Alan Shurson

Christopher Michael Marroquin

David L Johnson

Christopher Lee Tuma

Kevin J Przybylski

Mark David Pfeifer

Nathan David Karl

Michael Hans Fisher

Ankur Kanu Patel

Rebeccah J Vossberg

Timothy L McMillan

Lynn Robert Landin

Neil A Anderson

Louis Edward Behrens

Mark L Kyllo

Charles C Stratton

John Stephen Maas

Guy Alan Thompson

Max J C Koschmeder

Brian Edward Gregg

Randall John Fuhrman

Timothy Paul Duncan

Susan Ann Hodapp Benysh

Dennis Elmer Maloney

Susan A Benysh

Daniel F Jones

Paul Daniel Pederson, Jr

Kenneth E Monsen

Max John-Christopher Koschmeder

An air valve may include a sheet on a panel that serves as a portion of one wall of an air-cooled enclosure. The panel has a first aperture, having a first radius. The sheet may be deformable and resilient, and have a conductive film on one surface and a second aperture. A plurality of leaves lie in a plane parallel to the panel and extend inwardly a particular distance from a perimeter define the second aperture. The perimeter has a second radius equal to the first radius. The particular distance is less than the second radius. The leaves may deform in response to airflow. The second aperture has a first diameter and first depth in an un-deformed state, and a second diameter and second depth in a deformed state. The second diameter and second depth are greater than the first diameter and first depth.

Resilient deformable air valve

A method and structures implement an enhanced handheld transfer impedance probe including a rigid probe housing body that carries a pair of coaxial RF connectors providing connections to a network analyzer. A base member includes a respective pair of independent electrical contacts and a common interconnect electrical contact. Each of the respective electrical contacts includes a respective associated electrically conductive compressible pad. Each respective compressible pad extends between rigid stops having a set height to limit gasket compression and enable repeatable gasket compressions for repeatable measurements with the handheld transfer impedance probe. An interconnection structure includes respective interconnects connecting between the coaxial RF connectors and respective electrical contacts. The respective interconnects are contained within the rigid probe housing body and arranged to prevent movement of the respective electrical contacts and the associated electrically conductive compressible pads.

Implementing handheld transfer impedance probe

According to embodiments of the invention, a structure for cooling electronic components may be provided. The structure may include a heat sink having a plurality of parallel heat conducting elements. The structure may also include a plurality of fans, wherein the fans are interleaved with the heat conducting elements. The structure may also include a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. According to other embodiments, the structure may include a baffle located on a side of the heat sink in an upstream location within an airflow stream.

Interleaved heat sink and fan assembly

Methods and structures are provided for implementing feed-through and domain isolation using ferrite and containment barriers. A vertical isolator is provided between a first domain and a second domain on a printed circuit board with signals passing between the first domain and the second domain. The vertical isolator is placed over a domain separation gap between the first and second domains in the printed circuit board, the vertical isolator having a vertical isolation barrier between a first vertical plate coupled to the first domain and a second vertical plate coupled to the second domain. The vertical isolation barrier is formed of a unitary ferrite block or a non-conductive magnetic absorber material. A plurality of capacitance feed-through plates and a dielectric material are provided within the vertical isolator.

Implementing feed-through and domain isolation using ferrite and containment barriers

A device having an upper plate comprising a top face and a bottom face with an opening. A lower plate comprising a top face and a bottom face substantially parallel to the upper plate, with an opening. A middle plate between and substantially parallel to the upper plate and lower plate, capable of moving with respect to the upper plate and lower plate, and having a top face a bottom face and at least one opening. A plurality of gaskets configured to electrically connect the upper plate, the middle, plate, and the lower plate and provide an interface that is designed to allow the middle plate to slide substantially parallel to the upper plate and the lower plate. At least one waveguide through the at least one opening of the middle plate.

Movable shielded cable egress

A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the second conductive material hays a second central opening which is sufficient to substantially surround the fastener and maintain the electric connection between the printed circuit board and the chassis. A substantially annular impedance material is between and adjacent to the first conductive material and the second conductive material, the impedance material is sufficient to attenuate the electromagnetic interference from the system.

Device for attenuating propagation and reception of electromagnetic interference for a PCB-chassis structure

A grounded belt and drawer apparatus including a drawer, mounted on a first track, a tensioner body having a first pulley, a supporting member, and a first belt. The drawer moveable on a first line in a first direction and a second direction. The tensioner body mounted on a second track and moveable in the first direction and the second direction. The first belt having a first end and a second end, rounded over the first pulley, and a first segment and second segment extending distally from the first pulley in the first direction. The first belt conductively connected to the drawer and to a first fixed point which forms a conductive path from the drawer to the first fixed point.

Grounded belt and movable drawer apparatus

According to embodiments of the invention, a heat sink structure may be provided. The heat sink structure may include a first surface adapted to connect to an electronic component. The heat sink structure may also include a second surface adapted to provide heat transfer. The heat sink structure may also include a coating of radio-frequency absorbing material covering at least a portion of the second surface.

Heat sink structure with radio frequency absorption

A first planar prong adjacent to and parallel with, an exterior of the side of the enclosure. A second planar prong parallel to and spaced from an interior of the side of the enclosure and compress a first compressible gasket against the side of the enclosure. Furthermore, the second planar prong forms a first compartment between a first side of the second planar prong and the interior of the side of the enclosure, parallel to and spaced from an interior of the side of the enclosure. A planar base of the first planar prong and the second planar prong, adjacent to a cover of the enclosure. A first planar member having one end coupled perpendicular to a second side of the second planar prong and support a second compressible gasket in a second compartment formed between the planar member and the cover.

Device for attenuating propagation of electromagnetic emissions from an enclosure

An apparatus for distributing electromagnetic waves comprising a first plurality of plates coupled to a first rod. A second plurality of plates coupled to a second rod, wherein at least one of either the first or the second plurality of plates is capable of reflecting an electromagnetic wave. A portion of the second rod is situated inside the first rod. A first motor mechanically connected to the first rod, such that the first motor is capable of rotating the first rod. A second motor mechanically connected to the second rod, such that the second motor is capable of rotating the second rod, wherein rotational direction and speed of the second rod, when rotated by the second motor is independent of rotational direction and speed of the first rod, when rotated by the first motor.

Electromagnetic interference mode stirrer

A light pipe assembly may include a first light pipe having a light pipe column element at an end of the first light pipe. The light pipe column element may have a plurality of light pipe columns. The light pipe assembly may include a second light pipe having a plurality of light pipe column receptacles at an end of the second light pipe. Also, an electrically conductive panel having a light pipe aperture. The light pipe aperture may have a plurality of light pipe channels. The plurality of light pipe columns is adapted to pass through the plurality of light pipe channels and be received by the plurality of light pipe column receptacles.

Light pipe with electromagnetic interference shielding

An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes.

Heat sink apparatus with extendable pin fins

An electromagnetic interference (EMI) shield that increases the airflow through the EMI shield while preventing line-of-sight openings through the EMI shield. Two plates are coupled together. Each of the respective plates has a raised component with an aperture therethrough to provide a path through the plate. The raised component is preferably scoop-shaped with the aperture at one end and an opposite end tapering into the respective plate. At least a portion of one of the raised components overlaps at least a portion of the other of the raised components when the plates are coupled together to form a path through the plates, while the plates are coupled together. Line-of-sight openings through the plates, to an electronic device protected by the EMI shield, are at least partially prevented by the raised components.

Electromagnetic interference shield

A method and structures are provided for implementing press-lock electromagnetic compatibility (EMC) gaskets. A gasket includes a plurality of fasteners received through a plurality of corresponding mounting apertures in a perforated support surface for precise placement, and retention without adhesives. The corresponding mounting apertures have a diameter smaller than 1/20th of a wavelength of the highest frequency to be suppressed to remain independent of the shielding required. The gasket defines a cavity receiving compliant foam, and includes an absorber.

Implementing press-lock EMC gasket with absorber

A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.

Heatsink with substance embedded to suppress electromagnetic interference

Growing community of inventors

Rochester, MN, United States of America

Don Alan Gilliland