Stmicroelectronics(tours) Sas

Dominique Touzet

Vincent Jarry

Patrick Hougron

José Mendez

Yann Bedu

Jean-Paul Farroni

A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame.

Method for manufacturing semiconductor chips from a semiconductor wafer

A case for fuel cells including an upper plate formed of a stack of a first insulating board, portions of a first conductive layer, a second insulating board, and a second conductive layer, this stack including windows, fuel cells being placed under the first insulating board at the level of the windows to obstruct them, the stack further comprising first openings filled with a heat-transmitting material forming a contact between the periphery of the fuel cells and the second conductive layer.

Growing community of inventors

Savigne Sous le Lude, France

Dominique Touzet