L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des

L'air Liquide

Dominique Navarro

Sylvie Mellul

Frederic Rotman

The invention relates to a process for preparing interconnection substrates of hybrid circuits, comprising effecting on a support the deposition of a thick layer of ink or paste based on a non-noble metal, such as copper or other material having a 'copper compatible' formulation, by carrying out in succession a preliminary drying for eliminating solvents at a temperature on the order of 100.degree. C. to 150.degree. C., a firing comprising:

Process for preparing electrical connection means, in particular

The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising:

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Pont De La Maye, France

Dominique Navarro