Ev Group E. Thallner Gmbh

Dominik Zinner

Thomas Wagenleitner

Jurgen Markus Suss

Jurgen Mallinger

Thomas Plach

Christian Sinn

Friedrich Paul Lindner

Boris Povazay

Peter Starzengruber

Harald Rohringer

Jürgen Mallinger

Jürgen Markus Süss

Jürgen Markus SÜSS

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.

Apparatus and method for bonding substrates

The invention relates to a device and a method for the alignment of substrates.

Device and method for the alignment of substrates

A measuring device for determining a course of a bonding wave in a gap between a first substrate and a second substrate, and a method for determining a course of a bonding wave in a gap between a first substrate and a second substrate.

Measuring device and method for determining the course of a bonding wave

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.

Method and device for alignment of substrates

A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

Method for bonding substrates

A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.

Method and substrate holder for the controlled bonding of substrates

A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units, and a corresponding device for alignment and contact.

Growing community of inventors

Zell an der Pram, Austria

Dominik Zinner