Nxp B.v.

Dominik Xaver Simon

Abdellatif Zanati

Adrianus Buijsman

An integrated circuit package comprising an encapsulant, a semiconductor die in the encapsulant the semiconductor die comprising a plurality of die terminals, an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals and a land grid array provided on a bottom surface of the package. The land grid array comprises a plurality of package terminals, each package terminal configured to be soldered to a printed circuit board, and an opening, wherein the opening is aligned with the integrated waveguide launcher.

Growing community of inventors

Munich, Germany

Dominik Xaver Simon