Ev Group E. Thallner Gmbh

Dominik Treiblmayr

Anna Dudus

A method for producing micro- and/or nanostructures includes fixing a substrate with an embossing material on a substrate accommodating device, contacting of a structured stamp with the embossing material, curing of the embossing material, and removal of the embossing material from the structured stamp.

Method and device for producing micro- and/or nanostructures

A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are coated at least partially with a coating. In addition, the invention relates to a corresponding structural die as well as a device for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the device has coating means for coating the die structures.

Mould with a mould pattern, and device and method for producing same

A method for embossing at least one microstructure or nanostructure with an embossing die that has at least one embossing structure with the following steps, in particular the following sequence: aligning the embossing structure of the embossing die relative to a metering device, metering an embossing material in the embossing structure by means of the metering device, at least partial hardening of the embossing material and embossing of the embossing material, characterized in that the embossing structures point in a gravitational direction (G) at least in the case of the metering. In addition, the invention relates to a corresponding device.

Method and device for embossing structures

A process for embossing a structure in an embossing material that is applied on a substrate comprising the steps of embossing the embossing material by an embossing die and hardening the embossing material, wherein at least the substrate and/or the embossing die and/or at least one heating layer arranged between the substrate and the embossing material and/or between the embossing die and the embossing material are irradiated by means of microwaves for hardening the embossing material.

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Kirchdorf am Inn, Austria

Dominik Treiblmayr