Infineon Technologies Ag

Dominik Kohl

Horst Theuss

Stefan Uwe Schindler

Jochen Dangelmaier

Thomas Mueller

Cyrus Ghahremani

A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

Pre-mold for a microphone assembly and method of producing the same

A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

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Wenzenbach, Germany

Dominik Kohl