Greatbatch Ltd.

Wilson Greatbatch Ltd.

Figgie International, Inc.

Wilson Greatbatch Technologies, Inc.

Greatbach Ltd.

Dominick J Frustaci

Christine A Frysz

Robert A Stevenson

Keith W Seitz

Thomas Marzano

Jason Woods

William C Thiebolt

Richard L Brendel

Paul T Hallifax

Steven W Winn

Xiaohong Tang

William M Paulot

Gary Freitag

Tina L Urso

Kenneth Moceri

Warren S Dabney

Barry C Muffoletto

Robert Shawn Johnson

Buehl E Truex

Kenneth L Grubb

Michael Guidi

Esther S Takeuchi

Holly Noelle Moschiano

Christopher Michael Williams

Kishore Kumar Kondabatni

Mark J Roy

John E Roberts

Donald F Kaiser

Joseph M Probst

Philip S Wutz

Joseph E Spaulding

Raymond S Konopa

Michael A Reed

Daniel Baumer

John Skoumpris

Thomas A Skwara

Scott Hall

Donald H Hickel, Jr

Wendy Power

Robert W Siegler

Deborah McNally

Brian Mau

James P Dominiak

Hong Gan

Izrail Tsals

John C Duggan

Harvey A Hornung, Ii

Scott J Hynek

Shenandoah Hennrich

Ricahrd L Brendel

Bruehl E Truex

Shenandoah Henrich

Mark Visbisky

Harvey Hornung, Ii

Tina Urso

Gerald Larocque

Brenda Marchetti

William Thiebolt, Iii

Donald Hickel

Waren S Dabney

Donald Kaiser

Philip Wutz

Barry Muffaletto

A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.

Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board

A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400&#xb0; C. to about 700&#xb0; C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400&#xb0; C. to about 1,900&#xb0; C. for up to 6 hours; and a cool down portion at a rate of up to 5&#xb0;/minute from a maximum sintering temperature down to about 1,000&#xb0; C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device

A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device

A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device

An implantable cardioverter defibrillator (ICD) includes a communication interface operable to receive a communication signal from an external programmer. With the ICD not being in the presence of an MRI field generated by an MRI scanner, a communication signal is sent precharging a high energy storage capacitor before the patient undergoes the MRI scan. The signal also switches the ICD into an MRI mode which turns off the ICD's sensing functions detecting a dangerous ventricular arrhythmia. An operator monitors the patient's vital signs with sensors connected to the patient. If the patient does require the defibrillation shock, the operator sends a second communication signal delivering the defibrillation shock from the precharged high energy storage capacitor of the ICD. The patient can then be removed from the MRI scanner and the RF and gradient fields of the MRI scanner turned off.

Implantable cardioverter defibrillator designed for use in a magnetic resonance imaging environment

A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device

An implantable cardioverter defibrillator includes a communication interface operable to receive a communication signal from an external programmer. The communication signal includes a command to switch the ICD from a first mode to a second mode. A processor is in electrical communication with the communication interface and configured to switch the ICD between the first and second modes. A battery is configured to supply low DC voltage. A converter is configured to convert the low DC voltage to a high DC voltage. An energy storage capacitor is electrically coupled to the converter and configured to store a therapeutic energy or high DC voltage including at least 15 joules. The second mode includes activating the converter to convert the low DC voltage to the high DC voltage and storing the therapeutic energy or at least 15 joules within the energy storage capacitor during a period of time of the second mode.

A composite RF current attenuator for a medical lead includes a conductor having a distal electrode contactable to biological cells, a bandstop filter in series with the lead conductor for attenuating RF currents flow through the lead conductor at a selected center frequency or across a range of frequencies about the center frequency, and a lowpass filter in series with the bandstop filter and forming a portion of the lead conductor. The bandstop filter has a capacitance in parallel with a first inductance. In a preferred form, the lowpass filter includes a second inductance in series with the bandstop filter, wherein the values of capacitance and inductances for the composite RF current attenuator are selected such that it attenuates MRI-induced RF current flow in an MRI environment.

Composite RF current attenuator for a medical lead

An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

RF filter for an active medical device (AMD) for handling high RF power induced in an associated implanted lead from an external RF field

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Williamsville, NY, United States of America

Dominick J Frustaci