Nxp USA, Inc.

Dominic (PohMeng) Koey

Stephen Ryan Hooper

Fernando A Santos

Boon Yew Low

Chayathorn Saklang

Chanon Suwankasab

Fui Yee Lim

Crispulo Estira Lictao, Jr

Amornthep Saiyajitara

A circuit module includes a module substrate with a mounting surface, and a plurality of conductive features and electronic circuitry coupled to the mounting surface. Encapsulant material covers the electronic circuitry and the mounting surface, and an upper surface of the encapsulant material defined a first surface of the circuit module. A plurality of leadframe terminals, each separated from a non-planar leadframe unit, extend from the conductive features at the mounting surface through the encapsulant material toward the first surface of the circuit module. Each of the leadframe terminals is formed from an elongated planar conductive feature of a leadframe unit, and the plurality of leadframe terminals is electrically coupled to the electronic circuitry through the conductive features and the module substrate. Encapsulant divots may extend into the encapsulant material from the first surface of the circuit module, and proximal ends of the leadframe terminals terminate at the encapsulant divots.

Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules

A method of manufacturing a packaged semiconductor device is provided. The method includes affixing a sensor system to a die pad portion of a leadframe. A battery is affixed to the lead frame including a first terminal of the battery affixed to a first leg of the leadframe and a second terminal of the battery affixed to a second leg of the leadframe. An encapsulant encapsulates the sensor system, battery, and leadframe.

Semiconductor device with embedded battery and method therefor

Growing community of inventors

Shah Alam, Malaysia

Dominic (PohMeng) Koey