Infineon Technologies Ag

Dominic Maier

Thomas Kilger

Ulrich Wachter

Daniel Porwol

Alfons Dehe

Gottfried Beer

Bernd Goller

Claus Waechter

Franz-Xaver Muehlbauer

Georg Meyer-Berg

Stephan Pindl

Daniel Lugauer

Ralf Otremba

Edward Fuergut

Michael Bauer

Klaus Schiess

Tobias Schmidt

Michael Ledutke

Holger Doepke

Claus Von Waechter

Veronika Huber

Thorsten Meyer

Joachim Mahler

Saverio Trotta

Rainer Leuschner

Ashutosh Baheti

Mark Pavier

Christian Geissler

Uwe Wahl

Christoph Glacer

Maciej Wojnowski

David Tumpold

Chau Fatt Chiang

Chee Yang Ng

Ludwig Heitzer

Daniel Kehrer

Bernd Stadler

Markus Menath

Chooi Mei Chong

Johannes Lodermeyer

Matthias Steiert

Juergen Wagner

Paul Christopher Westmarland

Beng Keh See

Alfred Sigl

Ngoc-Hoa Huynh

Andreas Schlögl

Alfred Sigi

Franz Xaver Muehlbauer

Rui Miguel Moreira Araujo

Gerhard Metzger-Brückl

Joachim Eder

Siyuan Qi

The present disclosure concerns an emitter package for a photoacoustic sensor, the emitter package comprising a MEMS infrared radiation source for emitting pulsed infrared radiation in a first wavelength range. The MEMS infrared radiation source may be arranged on a substrate. The emitter package may further comprise a rigid wall structure being arranged on the substrate and laterally surrounding a periphery of the MEMS infrared radiation source. The emitter package may further comprise a lid structure being attached to the rigid wall structure, the lid structure comprising a filter structure for filtering the infrared radiation emitted from the MEMS infrared radiation source and for providing a filtered infrared radiation in a reduced second wavelength range.

Emitter package for a photoacoustic sensor

A MEMS sensor includes a sensor package and a membrane arranged in the sensor package, wherein a first partial volume of the sensor package adjoins a first main side of the membrane and a second partial volume of the sensor package adjoins a second main side of the membrane, wherein the second main side is arranged opposite the first main side. The MEMS sensor includes a first opening in the sensor package, said first opening connecting the first partial volume to an external environment of the sensor package in an acoustically transparent fashion. The MEMS sensor includes a second opening in the sensor package, said second opening connecting the second partial volume to the external environment of the sensor package in an acoustically transparent fashion.

MEMS sensor, MEMS sensor system and method for producing a MEMS sensor system

A device for debonding a structure from a main surface region of a carrier includes a tape for laminating to the structure, a first holder and a second holder for spanning the tape and to keep a tension of the tape. The second holder can be movable into a lifted position vertically offset to the main surface region of the carrier. The device can also include a deflecting-element for providing a deflection-line between the first holder and the second holder for deflecting the tape in response to moving the second holder into the lifted position. The deflecting-element can be moveable parallel to the carrier for moving the deflection-line parallel to the carrier and for debonding the structure, laminated to the tape, from the carrier.

Device and method for debonding a structure from a main surface region of a carrier

According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

System and method for a transducer in an EWLB package

A semiconductor device includes a semiconductor chip and a redistribution layer on a first side of the semiconductor chip. The redistribution layer is electrically coupled to the semiconductor chip. The semiconductor device includes a dielectric layer and an antenna on the dielectric layer. The dielectric layer is between the antenna and the semiconductor chip.

Semiconductor device including an antenna

The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

Semiconductor module

A semiconductor device having a lid, and method of making a semiconductor device having a lid is disclosed. The semiconductor device includes a substrate. A device is positioned at the substrate. A lid made of a semiconductor material is positioned over the device to form a protective cavity about the device. The lid is formed using a semiconductor process. In other examples, the lid may be made of a nonconductive material, such as a polymer material. The lids may be formed as part of a batch process.

Semiconductor device including a cavity lid

A method for handling a product substrate includes bonding a carrier to the product substrate by: applying a layer of a temporary adhesive having a first coefficient of thermal expansion onto a surface of the carrier; and bonding the carrier to the product substrate using the applied temporary adhesive. A surface of the temporary adhesive is in direct contact to a surface of the product substrate. The temporary adhesive includes or is adjacent a filler material having a second coefficient of thermal expansion which is smaller than the first coefficient of thermal expansion, so that stress occurs inside the temporary adhesive layer or at an interface to the product substrate or the carrier during cooling down of the temporary adhesive layer.

Method for handling a product substrate and a bonded substrate system

A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.

Semiconductor package with a through port for sensor applications

System and method for a transducer in an eWLB package

Method for producing a semiconductor module

Embodiments of the present disclosure provide an apparatus for determining a characteristic of a fluid. The apparatus may include a device configured to determine a hydrodynamic pressure of the fluid. The apparatus may further include a sensor configured to determine a hydrostatic pressure of the fluid or at least one component of the fluid. The apparatus may also include a common substrate on which the sensor and the device configured to determine a hydrodynamic pressure of the fluid may be commonly arranged, and an ASIC (Application Specific Integrated Circuit) which may be electrically coupled with at least one of the device or the sensor. The ASIC may be at least partially embedded in the common substrate.

Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid

A method for handling a product substrate includes bonding a carrier to the product substrate. A layer of a permanent adhesive is applied onto a surface of the carrier. A structured intermediate layer is provided. The applied permanent adhesive bonds the carrier to the product substrate. The structured intermediate layer is arranged between the product substrate and the carrier. A surface of the structured intermediate layer and a surface of the permanent adhesive are in direct contact to a surface of the product substrate. The structured intermediate layer decreases a bonding strength between the product substrate and the carrier.

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

A method for fabricating an electronic device is disclosed. In one example, the method comprises providing a semiconductor wafer, forming a plurality of cavities into the semiconductor wafer, filling a stabilization material into the cavities, fabricating a temporary panel by applying a cap sheet onto the semiconductor wafer, the cap sheet covering the cavities, singulating the temporary panel into a plurality of semiconductor devices, fabricating an embedded wafer by embedding the semiconductor devices in an encapsulant, removing the cap sheet of each one of the semiconductor devices, and singulating the embedded wafer into a plurality of electronic devices.

Temporary mechanical stabilization of semiconductor cavities

Growing community of inventors

Pleystein, Germany

Dominic Maier