Freescale Semiconductor,inc.

Dominic Koey

Stanley Job Doraisamy

Soo Choong Chee

Soon Kang Chan

An integrated circuit (IC) die has an active side and an inactive side, opposite the active side. A recess is formed within the interior of the inactive side and extends partially through the integrated circuit towards the active side. The IC die is part of a packaged IC device, where the die is attached to a package component such as a lead frame, substrate, or another die, using die attach adhesive that fills the recess, thereby providing a more reliable bond between the IC die and the package component.

Integrated circuit with recess for die attachment

A method of assembling Redistributed Chip Package (RCP) semiconductor devices. An active die structure is encapsulated in a molding compound with internal electrical contacts of the active die structure positioned at an active face of an encapsulation layer. A dummy die structure is positioned at a back face of the encapsulation layer. A redistribution layer is formed at an active face of the encapsulation layer. The redistribution layer includes a layer of insulating material and redistribution electrical interconnections. The insulating material is built up with grooves along saw streets. External electrical contacts exposed at a surface of the redistribution layer are connected with the redistribution electrical interconnections. The dummy die structure is removed and then the semiconductor devices are singulated.

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Kuala Lumpur, Malaysia

Dominic Koey