Delphi Technologies, Inc.

Dominic Carano

Joseph Howard Gladd

Kevin J Hawes

David Jay Vess

Richard A Natoli

Andres Eduardo Avila

An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a bus wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the bus wires are laid, they will pass through the holes in the PCB and/or pass through the wire slots of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween. Additionally, the electrical interconnect system includes a flexible strain relief bend formed on the bus wire to provide a flexible connection.

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Hubbard, OH, United States of America

Dominic Carano