Avago Technologies International Sales Pte. Limited

Domingo Figueredo

Chris Chung

Michael Leary

YongIk Choi

Ah Ron Lee

Li Sun

Sarah Kay Haney

Brice Ivira

Chang Kyu Choi

Tiberiu Jamneala

Hans G Rohdin

Ashish Alawani

Deog-Soon Choi

Marshall Maple

Alexia Kekoa

Yonglk Choi

Husnu Masaracioglu

In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Device having solder bump structure for improved mechanical, electrical, and/or thermal performance

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Substrate having undercut portion for stress mitigation

Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths

Stress mitigation structure

Bulk acoustic wave (BAW) resonators, and electrical filters that incorporate the BAW resonators, are described. Generally, the BAW resonators comprise a substrate comprising an acoustic reflector; a first electrode disposed over the acoustic reflector; a piezoelectric layer disposed over the first electrode, the piezoelectric layer comprising scandium-doped aluminum nitride (ASN); a diffusion barrier layer disposed over the piezoelectric layer; and a second electrode disposed over the diffusion barrier layer. The diffusion barrier layer configured to prevent diffusion of material of the first electrode into the piezoelectric layer.

Bulk acoustic wave resonators having doped piezoelectric material and an adhesion and diffusion barrier layer

A bulk acoustic wave (BAW) resonator includes: a plurality of acoustic reflectors disposed in a substrate; a lower electrode disposed over the plurality of acoustic reflectors; a piezoelectric layer disposed over the lower electrode; and a plurality of upper electrodes, disposed over the piezoelectric layer. One of the plurality of upper electrodes is formed over a respective one of the plurality of acoustic reflectors. Each of the plurality of upper electrodes, the piezoelectric layer, the lower electrode, and each of the acoustic reflectors form an individual active area.

Bulk acoustic wave resonator comprising multiple acoustic reflectors

A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound. The first electronic component includes a first die substrate with first electronic circuitry that generates electromagnetic radiation. The second electronic component includes a second die substrate with second electronic circuitry. The internal shield is electrically connected to ground and substantially covers a surface of the second die substrate facing away from the substrate, the internal shield being configured to shield the second electronic circuitry from the electromagnetic radiation generated by the first electronic circuitry. The molded compound is disposed over the substrate and the first and second electronic components, and the external shield is disposed on at least one outer surface of the circuit package and electrically connected to ground. The external shield is configured to protect the circuit package from external electromagnetic radiation and environmental stress.

Circuit package with internal and external shielding

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Fernandina Beach, FL, United States of America

Domingo Figueredo