Samsung Display Co., Ltd.

Dokyun Kwon

Kyongho Hong

Jeongho Yi

Jaebum Pahk

Gyoowan Han

Cheollae Roh

Toshinaru Suzuki

Jinwon Baek

Jinpyung Lee

Seokjoo Lee

Jihun Kang

A laser apparatus including a stage. A target substrate is mounted on the stage. The laser apparatus further includes a coupling unit disposed below the stage and coupled with a conveying unit, the conveying unit conveying the stage. The laser apparatus additionally includes a discharge unit disposed at a predetermined position for laser machining, configured to communicate with the coupling unit when docked with the coupling unit, and configured to discharge foreign matter that is generated during laser machining.

Laser apparatus including fastening holes and inlet grooves

A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.

Substrate processing apparatus and substrate processing method

A particle removal device includes: a stage on which a target substrate is disposed; an inner case defining a first discharge opening through which the stage is exposed to an internal space of the inner case; an outer case including: a side wall portion surrounding the inner case, a protrusion portion protruded from the side wall portion toward the inner case, and a second discharge opening in fluid connection with the first discharge opening; a suction pump connected to the second discharge opening; an air injector in fluid connection with the internal space; and an intake opening in fluid connection with the first and second discharge openings. A width of the intake opening as a distance between the distal end of the inner case and the distal end of the protrusion portion is smaller than a width of the first discharge opening.

Particle removal apparatus and laser cutting apparatus including the same

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Seoul, South Korea

Dokyun Kwon