Stats Chippac Pte. Ltd.

DokOk Yu

Ki Youn Jang

JoungIn Yang

JaeHyun Lee

Jae Han Chung

Gwangjin Kim

Hoon Jung

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching an integrated circuit to the substrate; molding an encapsulation directly on the integrated circuit and the substrate; forming a trench in the encapsulation having a trench bottom surface and surrounding the integrated circuit; and mounting a heatsink having a heatsink rim over the integrated circuit with the heatsink rim within the trench and the heatsink electrically isolated from the substrate.

Integrated circuit packaging system with heatsink cap and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate, the integrated circuit having an inactive side and a non-horizontal side; mounting a mold chase having a buffer layer over the integrated circuit; forming an encapsulation between the substrate and the buffer; and removing the mold chase, leaving the encapsulation having a recess exposing a portion of the non-horizontal side.

Integrated circuit packaging system with film assistance mold and method of manufacture thereof

Growing community of inventors

Seoul, South Korea

DokOk Yu