Samsung Electronics Co., Ltd.

Dohyun Ahn

Cheol Seong Hwang

Jungsoo Kim

Wonjun Jeong

Taeyun Kim

Minki Cho

Kwangsic Choi

Wonchul Cho

Gwan Yong Lee

Chonguk Heo

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

Camera module for heat dissipation and ground and electronic device including the same

A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.

Camera module

Growing community of inventors

Gyeongsangbuk-do, South Korea

Dohyun Ahn