Samsung Electronics Co., Ltd.

Dohoon Kwon

Kyunghyun Kim

Dougyong Sung

Sungwon Cho

Younsok Choi

Younseon Wang

Jungmo Yang

A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.

Growing community of inventors

Suwon-si, South Korea

Dohoon Kwon