Samsung Electronics Co., Ltd.

Dogeun Kim

Hongkyun Kim

Youngbok Jeon

Hyojae Bang

Jinhyun Kim

Hyo-Jae Bang

Sungchul Kim

Kyu-dong Kim

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

SSD including a case, securing element, circuit board, and at least one package, and methods of forming the SSD

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same

A semiconductor memory device is provided which includes a memory cell array including magnetic memory cells arranged in a matrix form of rows and columns and connected with bit lines and a source line; and a temperature sensing unit configured to generate a temperature sensing signal by sensing a temperature of the memory cell array. A memory controller, constituting a memory system together with the semiconductor memory device, may control read and write operations of the semiconductor memory device differently according to the temperature sensing signal of the temperature sensing unit.

Semiconductor memory device having discriminary read and write operations according to temperature

A hibernation method of a computing system that includes generating backup data and write addresses according to at least a portion of data utilized by the computing system at a hibernation request, generating conversion addresses corresponding to a first non-volatile memory when the write addresses correspond to a second non-volatile memory, and storing the backup data in the first non-volatile memory according to either the write addresses or the conversion addresses.

Computing system and hibernation method thereof

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. According to example embodiments, a solid state device (SSD) may include a circuit board, a connector, and a case. The circuit board may include a unibody board common to at least a first and a second form factor, first circuit board connection terminals of the first form factor on a front side of the board, and second circuit board connection terminals of the second form factor on a back side of the board. The connector may include connector connection terminals, where only one of the first circuit board connection terminals and the second circuit board connection terminals are connected to the connector connection terminals.

Growing community of inventors

Seoul, South Korea

Dogeun Kim