Pohang University of Science and Technology Foundation

Magnachip Semiconductor, Inc.

Lg Display Co., Ltd.

Samsung Electro-Mechanics Co., Ltd.

Posco

Do Young Kim

Jae Sik Choi

Jin Won Jeong

Hye Ji Lee

Suk Jin Ham

Soo Young Ji

Joohyun Lee

Seung Hwan Kim

Byeung Soo Song

Ji Seong Kim

Dongwoo Kim

Young Im Choi

Ji Heon Kim

Enrico Martinoia

YoungSook Lee

Eun Kyeong Kang

Won Yong Song

InWhan Hwang

Eun Woon Noh

Eun Hwa Jeong

Esther Vogt

Donghwan Shim

Kwan Sam Choi

Kyeong Sook Yoon

The present invention relates to a movable magnet type bicycle pedal, and a shoe coupling device equipped with a means for preventing attachment of metal powder. More particularly, the present invention relates to a movable magnet type bicycle pedal and a shoe coupling device equipped with a means for preventing attachment of metal powder, wherein the shoe coupling device and the pedal are respectively provided with a magnet, and are coupled to each other by magnetic force only during pedaling, and, when the pedaling is stopped or the running of a bicycle is stopped, the coupling between the magnets is released through a magnetic separation means and at the same time metal powder attached to a shoe is caused to fall so as to prevent the metal powder from being attached to the shoe.

Movable magnet bicycle pedal, and shoe coupling device equipped with means for preventing attachment of metal powder

A semiconductor package includes a first metal interconnection disposed in a semiconductor chip, a first bump group configured to be connected to the first metal interconnection, a first inner lead pattern group configured to be connected to the first bump group, a second metal interconnection disposed in the semiconductor chip, a second bump group configured to be connected to the second metal interconnection; and a second inner lead pattern group configured to be connected to the second bump group, wherein a density of the first metal interconnection is greater than a density of the second metal interconnection, such that a first pitch of the first lead pattern group is greater than a second pitch of the second lead pattern group.

Semiconductor package with inner lead pattern group and method for manufacturing the semiconductor package

A semiconductor package manufacturing method includes preparing a flexible film including input wire patterns and output wire patterns, preparing a semiconductor chip including metal bumps, attaching the semiconductor chip to one side of the flexible film, such that the metal bumps are connected to either one or both of the input wire patterns and the output wire patterns, and attaching a first absorbing and shielding tape to another side of the flexible film, wherein the first absorbing and shielding tape includes an absorption film and a protective insulating film disposed on the absorption film.

Semiconductor package and method of manufacturing semiconductor package

Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. The insulating layer composition according to the present invention can effectively lower a coefficient of thermal expansion thereof, and thus, a dimensional change due to heat can be minimized when the insulating layer composition is used as an insulation material of the substrate, resulting in a substrate having improved thermal stability.

Insulating layer composition for substrate, and prepreg and substrate using the same

A liquid crystal display device (LCD) includes a liquid crystal panel having a plurality of gate lines, a plurality of data lines, and a plurality of common voltage supply lines, the liquid crystal panel being divided into a plurality of blocks, a plurality of gate driver integrated circuits (ICs) connected to the plurality of gate lines, a plurality of data driver ICs connected to the plurality of data lines, and a plurality of common voltage compensators to supply compensated common voltages to the common voltage supply lines the corresponding blocks.

Liquid crystal display device for compensating a common voltage and the method of driving the same

The present invention relates to novel Pcr family genes that confer tolerance to heavy metals to plants and microorganisms. More particularly, the present invention relates to novel Pcr family genes that confer tolerance to cadmium. The invention also relates to plant and microorganisms transformed with any of the Pcr genes thereby having improved resistance to and increased level of toxic materials, and methods of removing heavy metals from contaminated soil and water contaminated by growing the Pcr-transformed plants on the contaminated soils and water.

PCR family genes which confer tolerance to heavy metals

Growing community of inventors

Goyang-si, South Korea

Do Young Kim