Samsung Electronics Co., Ltd.

Do-young Kam

Jun-Ho Lee

Jae-il Lee

Ki-Sang Kang

Hyun-seop Shim

Ju-il Kang

Seong-goo Kang

Sung-Jin Lee

Jung-wook Kim

Suk-chan Lee

Jae-Hong Shim

Hyung-suck Cho

In-kwang Yu

Jung-kun Shin

Goang-young Park

Jin-hyuk Choi

A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Multifunctional handler system for electrical testing of semiconductor devices

A method of manufacturing an LCD comprising, preparing a liquid crystal panel which comprises a substrate assembly and a polarizing plate, wherein the polarizing plate is attached to the substrate assembly, disposing a gas injecting part towards the plate surface of the liquid crystal panel, while the gas injecting part is exposed to atmospheric conditions, and applying a pressure to the plate surface of the liquid crystal panel by injecting gas through the gas injecting part. With this configuration, the present invention provides a method to remove bubbles between the polarizing plate and liquid crystal panel without the use of a chamber.

Method and apparatus for manufacturing an LCD

A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

Handlers for testing semiconductor devices that are capable of maintaining stable temperature in test environments

A reaction apparatus including: a main body having a reaction chamber with an upper opening thereof, a lid hinge, and a lid combined to the lid hinge, rotationally opening and closing the upper opening; a lifting member having a first end part separated from a rotation axis of the lid and rotatably combined with the lid, and a second end part rotatably combined to the main body, that moves in opening and closing directions; and a driver activating the lifting member. With this configuration, the present invention provides a reaction apparatus, with a lid that is opened and closed readily, and in which the lid parallelly contacts a sealing member, and thereby creating a vacuum in the reaction chamber with ease.

Reaction apparatus

A probe apparatus for the electrical inspection of a printed circuit board (PCB) assembly includes a probe assembly for inspecting the electrical circuitry of a PCB having electronic components mounted thereon. A first driving mechanism is provided for moving the probe assembly rectilinearly, and a guide is provided for guiding the rectilinear movement of the probe assembly. The probe assembly includes a probe tip for making contact with a solder joint on the PCB to detect a signal for the electrical inspection, a force sensor combined with the rear portion of the probe tip for measuring a contact force applied to the probe tip when the probe tip makes contact with the solder joint, a location sensor for measuring the location of the probe tip when in contact with the solder joint, and a device for controlling the location of the probe tip, according to the measured contact force and location thereof. The probe may further include a second driving mechanism for controlling the angle of inclination of the probe assembly to solder joints. Such a probe is improved in adaptability to the various patterns of the solder joints and thus enables stable testing of the PCB, by preventing poor soldering as well as vibration of the probe tips.

Probe apparatus for electrical inspection of printed circuit board

Growing community of inventors

Suwon-si, South Korea

Do-young Kam