International Business Machines Corporation

Do Yeung Yoon

Robert Dennis Miller

James L Hedrick

Willi Volksen

Kenneth Raymond Carter

Craig Jon Hawker

Richard Anthony DiPietro

Daniel Joseph Dawson

Victor Y Lee

Eric Gerhard Liniger

John Patrick Hummel

Robert F Cook

Moonhor Ree

Glenn Allen Held

Martha Alyne Harbison

Jeffrey Curtis Hedrick

Shui-Chih Alan Lien

Victor Yee-Way Lee

Uwe Paul Schroeder

Sally Ann Swanson

Anthony Cyril Lowe

Robert J Twieg

James Economy

Martha Inez Sanchez

Hugh Ralph Brown

Hyuk-Jin Cha

Ali Afzali-Arkadani

Sung-Mog Kim

The present invention relates to a light-modulating composition comprising a low molecular weight liquid crystalline material dispersed in a polymer including a non-mesogenic crosslinking monomer reacted with a mesogenic monomer comprising a mesogenic group, a spacer, and one or more reactive functionality.

Liquid crystalline light-modulating device

The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.

Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture

An in-plane switched liquid crystal device IPS LCD which provides fast switching times is formed by filling an empty IPS LCD panel having an array of display elements with a mixture of nematic liquid crystal material and a mesogenic polymerizable material, such as monomers or polymer precursers and suitable photoinitiators, curing, or cross-linking agents, and then polymerizing the mixture such that a phase-separated network of cross-linked polymer strands is formed. The cross-linked network of polymer strands displays an average orientation whose average orientation substantially conforms with nematic orientation of the nematic liquid crystal material in its &ldquo;field-off&rdquo; state.

Polymer stabilized in-plane switched LCD

The invention relates to a process for making an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the condensation product of silsesquioxane in the presence of a photosensitive or thermally sensitive base generator.

Process for manufacture of integrated circuit device

Process for manufacture of integrated circuit device using

The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polyarylene ether.

Process for manufacture of integrated circuit device using a matrix

The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.

Integrated circuit device and process for its manufacture

The invention relates to a process for making an integrated circuit device comprising (I) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the condensation product of silsesquioxane precursor in the presence of an organic amine having a boiling point greater than 150.degree. C.

The invention relates to an integrated circuit device comprising (i) a substrate, (ii) metallic circuit lines positioned on the substrate, and (iii) a porous dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.

The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.

Process for forming a circuit assembly

The present invention relates to a circuit assembly comprising the polyimide poly(3,4'-oxydiphenylene pyromellitimide).

Circuit assembly with polyimide insulator

Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good adhesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

Fine domain composite films of polyimide mixtures

A process for coating a substrate to provide good planarization and good mechanical and thermal stability, the process comprising applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and the ester being formed from an aromatic tetracarboxylic acid and an alcohol, and by reacting said oligomer and said ester in situ, with the process being characterized in that the ester reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40.degree. C. and 140.degree. C., and continues to react to form a cyclic imide.

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Los Gatos, CA, United States of America

Do Yeung Yoon