Samsung Electronics Co., Ltd.

Do-il Kong

Jong-yun Yun

Chung-Hyun Ryu

Eok-soo Shim

Cheol Kwon

Sung-chul Hur

Hu Zhao

Jong-gyu Park

Jae-beom Byun

Jae-Bum Byun

Doo-jin Yi

Il-ki Kim

A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.

Method of controlling temperature of non-volatile storage device

A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.

Multi-stacked structures of semiconductor packages

A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.

Memory card pack

Growing community of inventors

Hwaseong-si, South Korea

Do-il Kong