Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology Korea, Inc.

Medicare Pharmaceuticals Inc.

Other

Medicare Lc.

Do Hyun Na

Ji Young Chung

Chang Deok Lee

Jin Seong Kim

Ju Hoon Yoon

Dong Joo Park

Jae Yun Kim

Gi Tae Lim

Gyu Wan Han

Byong Woo Cho

Woon Kab Jung

Jin Hwan Jun

Kyung Pyo Kang

Choon Heung Lee

Chan Ha Hwang

Se Jin Yoon

Hyeon Jun Na

Young Hyun Na

Ki Cheol Bae

Byong Jin Kim

Yoon Joo Kim

Jae Ung Lee

Yung Woo Lee

Sung Soon Park

Dae Gon Kim

Young San Shin

Geon Go

Sang Jin Kang

Su Ji Na

Hyung Ii Jeon

A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

A drone includes a drone body, a drone body battery provided in the drone body and responsible for supplying power to the drone body, a parachute kit detachably coupled to the drone body and including a parachute therein, a battery detector provided in the parachute kit and responsible for checking the state of the drone body battery, and a parachute controller for controlling the parachute kit depending on the state of the drone body battery detected by the battery detector.

Drone, parachute kit for drones, and method of controlling drones

A semiconductor device includes a first semiconductor die, a first encapsulant surrounding the first semiconductor die, and a first redistribution structure formed on the first semiconductor die and the first encapsulant. The semiconductor device further includes a second semiconductor die, a second encapsulant surrounding the second semiconductor die, and a second redistribution structure formed on the second semiconductor die and the second encapsulant. The semiconductor device also include a conductive via electrically connecting the first redistribution structure to the second redistribution structure.

Semiconductor device and manufacturing method thereof

Disclosed is a composition for inhibiting the growth of virus. More particularly, the composition for inhibiting the growth of virus includes MDPX-V2021 represented by Formula 1, wherein MDPX-V2021 serves to inhibit a post-translational modification (PTM) stage in cells after SARS-CoV-2 penetrates into the body.

Composition for inhibiting growth of SARS-CoV-2 and method of preparing the same

The present disclosure relates to a composition for preventing or treating metabolic diseases, the composition containingHerba andPeel complex extracts as active ingredients. Specifically, in theHerba andPeel complex extracts according to the present disclosure, the content of ingredients useful for prevention of metabolic diseases including obesity is much higher than in extracts obtained only fromHerba. In addition, when a high-fat diet mouse model is administered the complex extracts, the levels of total cholesterol, LDL, and triglycerides in the blood are reduced. Accordingly, the complex extracts of the present disclosure may be used as a composition or functional material for preventing or treating metabolic diseases including obesity, hyperlipidemia, and hypercholesterolemia.

Composition for preventing or treating metabolic diseases containing artemisiae capillaris herba and citrus unshiu peel complex extracts as active ingredients

In one embodiment, a microfluidic sensor device includes microfluidic sensor mounted on and electrically connected a micro lead frame substrate. The microfluidic sensor is molded to form a package body. The package body includes a molded panel portion and, in some embodiments, a mask portion having one or more open channels, sealed channels, and/or a sealed chamber exposing an active surface of the microfluidic sensor. The molded panel portions and mask portions are configured to allow a material to dynamically or statically contact the microfluidic sensor for analysis.

Microfluidic sensor package structure and method

In one embodiment, a semiconductor package includes a first semiconductor die having a first surface facing upwardly to expose a bond pad, a second semiconductor die having a first surface facing downwardly to expose a bond pad and disposed to be offset with the first surface of the first semiconductor die, and an encapsulant encapsulating the first semiconductor die and the second semiconductor die together. Throughholes are disposed in the encapsulant adjacent the bond pad of the first semiconductor die and adjacent the bond pad of the second semiconductor die.

Semiconductor device

The method of fabricating a semiconductor device may include forming a semiconductor die on a substrate, forming an interposer including at least one integrated circuit connected to the semiconductor die on the substrate or on the semiconductor die, and performing encapsulation to surround the semiconductor die and the interposer.

Method of fabricating a semiconductor device having an interposer

A bond pad and a method of making the same for a semiconductor die has a bonding region formed on the bond pad. A test region is formed on the bond pad and is adjacent to the bonding region.

Structure of bond pad for semiconductor die and method therefor

A semiconductor device and a method of fabricating the same. An interposer used for the semiconductor device includes integrated circuits therein to realize the functions of a decoupling capacitor, an ESD preventing circuit, an impedance matching circuit, and termination. The semiconductor device may include a semiconductor die with a through silicon via (TSV) structure having two or more through electrodes that pass through the semiconductor die, in which each of the through electrodes are connected to a respective bond pad of the semiconductor die.

Semiconductor device having an interposer

In accordance with the present invention, there is provided a semiconductor package and a fabrication method thereof. The semiconductor package is provided with a substrate made of metal, thereby improving efficiency of thermal emission from a semiconductor die mounted to the substrate, and simplifying the fabrication process for the substrate which reduces fabricating costs. Further, unlike a conventional land, a rivet electrically insulated with the substrate is inserted into a corresponding hole of the substrate, the upper and lower surfaces of the rivet being removed to form land, thereby simplifying the fabrication process for the substrate which further reduces fabricating costs.

Increased I/O semiconductor package and method of making same

Disclosed is a lead frame, a semiconductor device and a fabrication method related to the semiconductor device. Since the lead frame has a land connecting bar, an upper surface of which is half-etched, the land connecting bar is more easily removed by a blade than a conventional land connecting bar in a fabrication process for the semiconductor device. Accordingly, stress applied to the lands when the land connecting bar is removed is reduced, and a flatness of the lands is maintained. Also, first and second lands constituting the lands are alternately formed with the land connecting bar, leads are alternately formed with the second lands, and wire bonding regions of the leads are positioned on a plane higher than the second lands. Accordingly, an interval between the conductive wires can be constantly maintained and the conductive wires have different traces, thus preventing a short between the conductive wires due to wire sweeping in an encapsulation process.

Semiconductor package with half-etched locking features

Disclosed are an image sensor package and its manufacturing method. As an example, an infrared ray protection glass is positioned directly on an image sensing region of an image sensor die. An electrically conductive wire and so forth located outside the image sensing region are encapsulated. At this time, one surface of the infrared ray protection glass is exposed outwardly. A mount holder to which a barrel with lenses is coupled is adhered on a surface of the encapsulant outside the infrared ray protection glass. The mount holder has a similar width to that of the image sensor die. Accordingly, the overall width of the image sensor package can become reduced, and the electrically conductive wire is protected against oxidization because it is surrounded by the encapsulant.

Growing community of inventors

Seoul, South Korea

Do Hyun Na