Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Corporation

Hanon Systems

Hanon Systems Efp Korea Inc.

Do-Hyun Kim

Jae Yeon Kim

Sang Hyun Lee

Yeonho Kim

Hoyoung Jeong

Ho Sung Kang

Seong Woo Jeong

Jeong Wan Han

Jungbum Choi

Minkyeong Park

Jaekyu Sung

Oh-Sang Shin

Sung-Hwan Choi

A semiconductor package including a package substrate including first and second bonding pads, third bonding pads spaced apart from the first bonding pads, and fourth bonding pads spaced apart from the second bonding pads; a first chip stack including first chips stacked on the package substrate, each first chip including first signal pads and first power/ground pads alternately arranged; a second chip stack including second chips stacked on the first chip stack, each second chip including second signal pads and second power/ground pads alternately arranged; first lower wires that connect the first signal pads to the first bonding pads; second lower wires that connect the first power/ground pads to the second bonding pads; first upper wires that connect the second signal pads of the second chips to the third bonding pads; and second upper wires that connect the second power/ground pads of the second chips to the fourth bonding pads.

Semiconductor package

An embodiment coolant control module includes a housing including a coolant inlet configured to receive a coolant, a coolant outlet configured to discharge the coolant, an internal passage connecting the coolant inlet and the coolant outlet, and a pump mounting part adjacent to the coolant outlet. The coolant control module further includes a control valve disposed inside the housing and configured to change a direction of the coolant, a coolant pump coupled to the pump mounting part of the housing, a driving motor unit mounted on the housing, connected to the control valve, and configured to drive the control valve, and a controller mounted on the housing, connected to the coolant pump and the driving motor unit, and configured to control an operation of the coolant pump and the driving motor unit.

Coolant control module

Growing community of inventors

Asan-si, South Korea

Do-Hyun Kim