Seoul Semiconductor Co., Ltd.

Do Choul Woo

Hyuck Jun Kim

Se Min Bang

Seung Ri Choi

Se Won Tae

Min Hong Kim

Chung Hoon Lee

Mi Gyeong Go

Mi Gyeong Ko

A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

Light emitting diode package

A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.

A light emitting diode package includes: at least one light emitting diode chip; a housing on which the at least one light emitting diode chip is mounted, the housing being open at at least one surface thereof to allow light emitted from the at least one light emitting diode chip to be discharged through the open surface of the housing; and a plurality of pads disposed on a second surface of the housing different from a first surface of the housing through which light is discharged, the plurality of pads being electrically connected to the at least one light emitting diode chip, wherein the housing has a plurality of grooves formed on a third surface thereof adjacent to the second surface.

Light emitting device package

Disclosed are a method of fabricating a light emitting diode package with a surface treated resin encapsulant and a package fabricated by the method. According to the method of fabricating a light emitting diode package, a resin encapsulant encapsulating a light emitting diode chip is surface treated using plasma. Thus, a bonding force between the surface treated resin encapsulant and a resin molding member covering it is increased.

Growing community of inventors

Ansan-si, South Korea

Do Choul Woo