Applied Materials, Inc.

Dmitry Sklyar

Jonathan Paul Domin

Steven M Zuniga

Jeonghoon Oh

Shou-Sung Chang

Paul D Butterfield

Jay Gurusamy

Haosheng Wu

Hari N Soundararajan

Jagan Rangarajan

Gerald John Alonzo

Chad Pollard

Brett Christian Hoogensen

Ricardo Martinez

Shuchivrat Datar

Calvin Lee

William Wadsworth

Andrej Rolny

Andrew Pavloski

Hung Xuan Hoang

Farooq Aleem

A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and the vessel, a sensor to monitor a steam parameter, and a control system. The control system causes the valve to open and close in accordance with a steam delivery schedule in a recipe, receive a measured value for the steam parameter from the sensor, receive a target value for the steam parameter, and perform a proportional integral derivative control algorithm with the target value and measured value as inputs so as to control the first valve and/or a second pressure release valve and/or the heating element such that the measured value reaches the target value substantially just before the valve is opened according to the steam delivery schedule.

Control of steam generation for chemical mechanical polishing

Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polishing system. In one embodiment, a substrate processing method includes winding a used portion of a polishing article onto a take-up roll of a polishing system by rotating a first spindle having the take-up roll disposed thereon; measuring, using an encoder wheel, a polishing article advancement length of the used portion of the polishing article wound onto the take-up roll; determining a tensioning torque to apply to a supply roll using the measured polishing article advancement length; and tensioning the polishing article by applying the tensioning torque to the supply roll.

Methods for a web-based CMP system

In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow controllers (LFCs) coupled to an Ethernet for Control Automation Technology (EtherCAT) bus automatically downloads a copy of the updated controller configuration data through the EtherCAT bus. Each of the plurality of liquid flow controllers controls fluid flow of a separate fluid line from a plurality of fluid lines in the substrate processing system, fluid flow through the plurality of fluid lines is controlled using the plurality of liquid flow controllers having the updated controller configuration data.

Ethercat liquid flow controller communication for substrate processing systems

The position sensor (20) and method of the present invention allows detecting proper placement of substrate holders (25) in a processing apparatus (35), and can also be used to detect displacement of the substrates (70) within the substrate holder (25). The position sensor (20) comprises (a) an optical emitter (120) capable of emitting a light beam, (b) an optical sensor (125) capable of sensing the light beam emitted by the optical emitter (120), and (c) a light regulator (130) in a path (135) of the light beam that is capable of blocking the light beam from the optical sensor when the substrate holder (25) is improperly positioned in the process chamber (40).

Position sensor system for substrate holders

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San Jose, CA, United States of America

Dmitry Sklyar