Intel Corporation

Divya Pratap

Srinivas V Pietambaram

Xiaoqian Li

Nitin A Deshpande

Srikant Nekkanty

Wesley Brook Morgan

Khaled Ahmed

Robert Alan May

Richmond Hicks

Sri Ranga Sai Boyapati

Brandon C Marin

Jeremy D Ecton

Sai Vadlamani

Hiroki Tanaka

Gregorio R Murtagian

Todd R Coons

Omkar Karhade

Nitin Deshpande

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

Faraday rotator interconnect as a through-via configuration in a patch architecture

A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.

Immersion compatible optical interconnect

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

Enabling passive alignment for lens attach

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Package expanded beam connector for on-package optics

Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

Active optical coupler

In some examples, a display includes a plurality of display pixels. Each display pixel includes one or more light emitters. At least some of the plurality of display pixels also includes a light detector.

Display with pixel level eye tracking

Growing community of inventors

Hillsboro, OR, United States of America

Divya Pratap