Sika Technology Ag

Dirk Urbach

Kai Paschkowski

Doreen Janke

Martin Linnenbrink

André Buchholz

Mathias Cordes

Thomas Hanhörster

Michael Oeser

A hot-melt glue composition, including a) at least one atactic poly-&#x3b1;-olefin (APAO) that is solid at 25&#xb0; C.; b) at least one hydrocarbon resin having a softening point of at least 80&#xb0; C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150&#xb0; C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.

Polyolefin hot-melt glue having a low reactivation temperature and high heat stability and use thereof for vacuum deep-drawing lamination

A water-based primer composition is particularly suitable for the pre-treatment of polycarbonate substrates, and has a component K1 having an aqueous epoxy resin dispersion, an aqueous polyester-polyurethane dispersion and an aqueous polyacrylate dispersion, and optionally a water-miscible organic solvent, and a second component K2 containing a water-dispersible curing agent based on isocyanate. The primers provide a strong bonding of subsequently applied adhesives to polycarbonate substrates, and permit a processing with a significant reduction in VOC emissions and the prevention of the occurrence of stress-cracks.

Water-based primer composition for polycarbonate and polycarbonate blends

A hot-melt adhesive composition, the use thereof, and a composite body including the hot-melt adhesive composition. The hot-melt adhesive composition includes a polyolefin P, which is solid at 25&#xb0; C., a soft resin WH with a softening point between &#x2212;10&#xb0; C. and 40&#xb0; C., and a polar modified polyolefin wax PW.

Hot-melt adhesives with improved adhesion on low-energy surfaces

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Ahrensburg, Germany

Dirk Urbach