Continental Teves, Ag and Company Ohg

Dirk Theobald

Jakob Schillinger

Dietmar Huber

Bernhard Schmid

Roland Burghardt

Roland Hilser

Veith Albrecht

The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.

Housing-side separating layer for the stress decoupling of potted electronics

A micromechanical acceleration sensor, including at least one substrate, one or more frames, at least a first frame of which is suspended directly or indirectly on the substrate by at least one spring element, and is deflected with respect to the substrate when at least a first acceleration acts, and at least a first seismic mass which is suspended on the first frame or an additional frame by at least one spring element, and is deflected with respect to this frame when an acceleration acts which is, in particular, different from the first acceleration.

Micromechanical acceleration sensor

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Eschborn, Germany

Dirk Theobald