Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Dirk Tews

Christian Sparing

Lutz Brandt

Martin Thoms

Gabriela Schmidt

Fabian Michalik

Markku Lager

Wonjin Cho

Norbert Lützow

Arno Clicque

Felix Tang

Cedric Lin

Toshio Honda

Neal Wood

Aaron Hahn

Norbert Luetzow

Thomas Hülsmann

Mirko Kloppisch

Meng Che Hsieh

Andry Liong

Belen Gil IBÀNEZ

Liu Zhiming

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

A method for manufacturing a printed circuit board, comprising in order steps (i) providing a non-conductive substrate having on a surface copper circuitry with a copper surface, wherein said surface is chemically treated by (a) oxidation and subsequent reduction reaction and/or (b) organic compound attached to said surface, a permanent, non-conductive, not fully polymerized cover layer covering at least partially said surface, (ii) thermally treating the substrate with the cover layer at temperature from 140&#xb0; C. to 250&#xb0; C. in atmosphere containing molecular oxygen at 100000 ppm or less, based on the total volume of the atmosphere, wherein a substrate with a permanent, non-conductive cover layer is obtained, with the provisos that (ii) is after (i) but before any metal or metal alloy is deposited onto the cover layer, and that in (ii) the cover layer is fully polymerized in one thermal treating step, if the cover layer is a solder mask.

Method for manufacturing a printed circuit board

The present invention relates to an aqueous composition for and a process for etching copper and copper alloys applying said aqueous composition. The aqueous composition comprises a source for Feions, at least one acid, at least one triazole or tetrazole derivative, and at least one etching additive selected from N-alkylated iminodipropionic acid, salts thereof, modified polyglycol ethers and quaternary ureylene polymers. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.

Aqueous composition for etching of copper and copper alloys

A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy and an excess layer of tin or tin alloy, providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7, and contacting said substrate with said aqueous etching solution for removing said excess tin or tin alloy layer on top of the recessed structures filled with tin or a tin alloy.

Process for etching a recessed structure filled with tin or a tin alloy

To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N(R)(R)&#x2014;(CH)&#x2014;N(H)&#x2014;C(Y)&#x2014;N(H)&#x2014;(CH)&#x2014;N(R)(R)&#x2014;R}n X, with R, R, R, R, R, Y and Xbeing defined as claimed.

Non-etching non-resist adhesion composition and method of preparing a work piece

Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of &#x2266;100 &#x3bc;m.

Composition and method for micro etching of copper and copper alloys

The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

Composition and method for improved adhesion of polymeric materials to copper alloy surfaces

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Berlin, Germany

Dirk Tews