Robert Boschgmbh

Dirk Scholz

Thomas Kaiser

Gerhard Koelle

Wolfgang Jacob

Ralf Schmid

Dittmar Klett

Bernd Bireckoven

Christoph Ruf

Peter Urbach

Hermann Kersting

Alexander Wallrauch

Kuno Wolf

Hans-Reiner Krauss

Juergen Zaremba

A spark plug for an internal combustion engine, including an electrical connecting arrangement on a connection-side end, an end on the combustion-chamber side pointing toward a combustion chamber, an insulator and a housing having a thread for attaching the spark plug to an engine component, a first sealing area and a second sealing area being provided between the insulator and the housing, the first sealing area being situated closer to the connection-side end and the second sealing area being situated closer to the end on the combustion-chamber side, a tool engagement area for transmitting a torque to the spark plug for fitting or removing the spark plug being situated in an area of the spark plug which lies between the connection-side end and the first sealing area.

Spark plug having a reduced physical volume

A spark plug which includes an end at its combustion chamber end, and an end at its connecting end, as well as a housing and an insulator situated in the housing. The insulator has a longitudinal bore having a longitudinal axis, a center electrode situated in the longitudinal bore of the insulator, a first ground electrode which extends into the region of the longitudinal axis of the insulator, and a second ground electrode which is situated at a distance from the longitudinal axis of the insulator laterally next to the center electrode. The insulator has a front section, facing the first ground electrode, which has an end face. The insulator has an outside diameter d and an inside diameter c, d&#x2212;c, that is, the difference between outside diameter d and inside diameter c, in the front section of the insulator being not greater than 1.9 mm.

Spark plug element having defined dimensional parameters for its insulator component

Disclosed in a power semiconductor module which includes a stack of carrier substrates, disposed one above the other in multiple layers and provided with at least one conductor track on at least one main surface, in which at least one electronic semiconductor component is disposed between two adjacent carrier substrates of the stack and is contacted electrically and heat-conductively to at least one conductor track of a carrier substrate disposed in the stack above the semiconductor component and to at least one further conductor track of a carrier substrate disposed in the stack below the semiconductor component. To both improve heat output and provide a compact design, the two outer carrier substrates of the stack are embodied as one upper and one lower housing wall of a closed housing part surrounding the at least one semiconductor component, and the interstices between the stacked carrier substrates are tightly closed by an encompassing wall secured to the carrier substrates.

Power semiconductor module

Growing community of inventors

Stuttgart, Germany

Dirk Scholz