Atotech Deutschland Gmbh

Dirk Rohde

Heiko Brunner

Josef Gaida

Olivier Mann

Andreas Kirbs

Bernd Roelfs

Jan Sperling

Jens Palm

Grigory Vazhenin

Mauro Castellani

Angela Llavona-Serrano

Stefanie Ackermann

Ralf Schmidt

Himendra Jha

Stefan Pieper

Kun Si

Onas Bolton

Frank Von Horsten

Lars Kohlmann

Thomas Pliet

Agnieszka Witczak

Gerhard Steinberger

Christian Ohde

Sven Rückbrod

Jun Higuchi

Timo Bangerter

Manuel Pölleth

Desthree Darwin

Sandra Niemann

Angelo Ferro

Andre Schmökel

The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:

Acidic aqueous composition for electrolytic copper plating

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising 

Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising 

An aqueous indium or indium alloy plating bath comprising  

Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy

The present invention deals with a process for deposition of indium or indium alloys and an article obtained by the process, wherein the process includes the steps

Process for indium or indium alloy deposition and article

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and/or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition and method for deposition of copper

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and at least one guanidine compound. The plating bath is particularly useful for plating recessed structures with copper and build-up of copper pillar bump structures.

Electrolytic copper plating bath compositions and a method for their use

The present invention relates to aqueous acidic plating baths for copper and copper alloy deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer comprising amino residues on both termini and which is free of organically bound halogen. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.

Copper plating bath composition

A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

Method for copper plating

An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.

Aqueous, acid bath and method for the electrolytic deposition of copper

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Berlin, Germany

Dirk Rohde