Rogers Corporation

World Properties, Inc.

Other

Dirk M Baars

Sankar Paul

Trevor Polidore

Murali Sethumadhavan

Bruce B Fitts

Kristi Dhimiter Pance

Karl Edward Sprentall

Gianni Taraschi

Roshin Rose George

Stephen O'Connor

William Blasius

Christopher Brown

Allen F Horn, Iii

Thomas A Koes

Sergio Clavijo

Carlos L Barton

Scott D Kennedy

Michael S White

Michael Lunt

Dale J Doyle

Diana J Williams

Sam Henson

John Dobrick

John R Sanford

Shawn P Williams

Shailesh Pandey

Seung B Chun

Christopher J Caisse

Jared DuPerre

Hillary P Borges

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22&#xb0; C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23&#xb0; C.

Photocurable compositions for stereolithography, method of forming the compositions, stereolithography methods using the compositions, polymer components formed by the stereolithography methods, and a device including the polymer components

A method of making a dielectric, Dk, electromagnetic, EM, structure, includes: providing a first mold portion comprising substantially identical ones of a first plurality of recesses arranged in an array; filling the first plurality of recesses with a curable first Dk composition having a first average dielectric constant greater than that of air after full cure; placing a substrate on top of and across multiple ones of the first plurality of recesses filled with the first Dk composition, and at least partially curing the curable first Dk composition; and, removing the substrate with the at least partially cured first Dk composition from the first mold portion, resulting in an assembly having the substrate and a plurality of Dk forms including the at least partially cured first Dk composition, each of the plurality of Dk forms having a three dimensional, 3D, shape defined by corresponding ones of the first plurality of recesses.

Dielectric electromagnetic structure and method of making the same

An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Electromagnetic dielectric structure adhered to a substrate and methods of making the same

A dielectric lens, includes: a three-dimensional, 3D, body of dielectric material having a spatially varying dielectric constant, Dk; the 3D body having at least three regions R(i) with local maxima of dielectric constant values Dk(i) relative to surrounding regions of respective ones of the at least three regions R(i), locations of the at least three regions R(i) being defined by local coordinates of: azimuth angle(i), zenith angle(i), and radial distance(i), relative to a particular common point of origin associated with the 3D body, where (i) is an index that ranges from 1 to at least 3; wherein the spatially varying Dk of the 3D body is configured to vary as a function of the zenith angle between a first region R(1) and a second region R(2) at a given azimuth angle and a given radial distance.

Dielectric lens and electromagnetic device with same

A stereolithography method of manufacture of a polymer structure having a spatially gradient dielectric constant, including: providing a volume of a liquid, radiation-curable composition; irradiating a portion of the liquid, radiation-curable composition with activating radiation in a pattern to form a layer of the polymer structure; contacting the layer with the liquid, radiation-curable composition; irradiating the liquid, radiation-curable composition with activating radiation in a pattern to form a second layer on the first layer; and repeating the contacting and irradiating to form the polymer structure, wherein the polymer structure comprises a plurality of unit cells wherein each unit cell is integrally connected with an adjacent unit cell, each unit cell is defined by a plurality of trusses formed by the irradiation, wherein the trusses are integrally connected with each other at their respective ends, and the trusses of each unit cell are dimensioned to provide the spatially gradient dielectric constant.

Method for the manufacture of a spatially varying dielectric material, articles made by the method, and uses thereof

In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof

A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith

A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Circuit materials, circuits laminates, and method of manufacture thereof

A component for an electrochemical cell comprises a thermally and electrically conductive core, wherein the conductive core comprises apertures, and wherein the conductive core further comprises an active area substantially covered by an electrically and thermally conductive polymeric composite. The conductive polymeric composite is adhered to the core by an adhesion promoter comprising electrically conductive particles to reduce the volume resistivity of the component, and an optional adhesive composition. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter &#xb0; K. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

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South Windsor, CT, United States of America

Dirk M Baars