Infineon Technologies Ag

Qimonda Ag

Dirk Grueneberg

Klaus Goller

Reiner Schwab

Jens Bachmann

A wafer inspection system and method is disclosed. On embodiment includes an edge defect detection unit, an optical inspection unit and a processor unit. The edge defect detection unit is configured to detect defects occurring in an edge area of the wafer and to record edge defect positions. The optical inspection unit is configured to capture images of functional devices in a functional area of the wafer surrounded by the edge area and to record device defect positions related to the functional devices. The processor unit is configured to output a data set relating the edge and device defect positions to the same coordinate system.

Wafer inspection system and method

The present invention provides a device having a useful structure which is arranged on a substrate and has a useful structure side edge. In addition, an auxiliary structure is arranged on the substrate adjacent to the useful structure, the auxiliary structure having an auxiliary structure side edge, wherein the useful structure side edge is opposite to the auxiliary structure side edge separated by a distance, and wherein the auxiliary structure useful structure distance is dimensioned such that a form of the useful structure side edge or a form of the substrate next to the useful structure side edge differs from a form in a device where there is no auxiliary structure.

Growing community of inventors

Dresden, Germany

Dirk Grueneberg