Advanced Micro Devices Corporation

Neoconix, Inc

Pandoodle Corporation

High Connection Density Inc.

Other

Dirk Dewar Brown

Takeshi Nogami

Shekhar Pramanick

John A Iacoponi

John David Williams

David M Ludwigsen

Mark Bradshaw

Sergey D Lopatin

Che-Yu Li

Hongjun Yao

Robert John Glassett

Christy Mei-Chu Woo

Zhineng Fan

William B Long

Young-Chang Joo

Hassan O Ali

Jason Griffith

Imran Hashim

Todd P Lukanc

Simon S Chan

Kai Yang

Guarionex Morales

Eric Michael Radza

Sharon Laura Moriarty

Loch T Brown

Christopher James MacDonald

Tingbao Chen

Harrison Rose

Jeffrey Alan Amdur

Zineng Fan

The present invention discloses a new method for analyzing, modifying, and distributing digital images and video in a quick, efficient, practical and/or cost-effective way. The method of processing video can take a different region or object and replace the pixels in the frames of the scenes that comprise the features and characteristics of the identified region or object with a different set of pixels. The replacement or other customizations of the frames and scenes lead to a naturally integrated video or image which is indistinguishable by the human eye or other visual system. In one embodiment, this invention can be used to provide different advertising elements into an image or set of images for different viewers, or to enable a viewer to control elements within a video and add their own preference or other elements.

Method and system for dynamically analyzing, modifying, and distributing digital images and video

A system and method for object and area detection and replacement in an image includes identifying an object or area in one or more sequential images that form a moving image sequence and replacing some or all of the identified object or areas with another image such that the image looks to be part of the original composition of the original image including lighting, shadows, placement, occlusion, orientation, position, and deformation.

Method of identifying and replacing an object or area in a digital image with another object or area

A customized animation video system and method generate a customized or personalized animated video using user input where the customized animated video is rendered in a near immediate timeframe (for example, in less than 10 minutes). The customized animation video system and method of the present invention enable seamless integration of an animated representation of a subject or other custom object into the animated video. That is, the system and method of the present invention enable the generation of an animated representation of a subject that can be viewed from any desired perspective in the animated video without the use of multiple photographs or other 2D depictions of the subject. Furthermore, the system and method of the present invention enables the generation of an animated representation of a subject that is in the same graphic style as the rest of the animated video.

User customized animated video and method for making the same

A system for batch forming a sheet of spring elements in three dimensions is described. A spring element sheet containing spring elements defined in two dimensions is arranged between two mating die press plates. A force is applied to the mating die press plates to form the two-dimensional spring contact elements into three dimensions. Alternatively, configurable die press plates are used to selectively form a two-dimensional spring element sheet into three-dimensional spring contacts.

Method and system for batch manufacturing of spring elements

An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.

Structure and process for a contact grid array formed in a circuitized substrate

A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

Connector for making electrical contact at semiconductor scales

A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.

Contact grid array formed on a printed circuit board

An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.

Land grid array connector including heterogeneous contact elements

A connector for electrically connecting to pads of a land grid array includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements formed on the first surface of the dielectric layer. Each contact element includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion. The elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer. Each elastic portion of the multiple number of contact elements elastically engages a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, each elastic portion has an elastic working range on the order of the electrical path length of the contact element.

Remountable connector for land grid array packages

A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.

Circuitized connector for land grid array

A self-aligned semiconductor interconnect barrier between channels and vias is provided which is self-aligned and made of a metallic barrier material. A channel is conventionally formed in the semiconductor dielectric, lined with a first metallic barrier material, and filled with a conductive material. A recess is etched to a predetermined depth into the conductive material, and the second metallic barrier material is deposited and removed outside the channel. This leaves the conductive material totally enclosed in metallic barrier material. The metallic barrier material is selected from metals such as tantalum, titanium, tungsten, compounds thereof, alloys thereof, and combinations thereof.

Self-aligned semiconductor interconnect barrier and manufacturing method therefor

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Santa Clara, CA, United States of America

Dirk Dewar Brown