Osram Oled Gmbh

Osram Opto Semiconductors Gmbh

Ams-osram International Gmbh

Dirk Becker

Erwin Lang

Thomas Dobbertin

Markus Heinrich Klein

Matthias Sperl

Thilo Reusch

Thomas Schwarz

Karsten Diekmann

Benjamin Krummacher

Tilman Schlenker

Andreas Biebersdorf

Daniel Steffen Setz

Bernd Barchmann

Arndt Jaeger

Richard Baisl

Martin Haushalter

Christian Schmid

Thomas Kippes

Claus Jaeger

Zeljko Pajkic

Stephan Haslbeck

Andreas Waldschik

Björn Hoxhold

Philipp Schlosser

Martin Wittmann

Doreen Heppner

Markus Klein

In an embodiment a method includes providing a substrate having at least one conductor track situated thereon, applying at least one accumulation of an electrically conductive material to a surface of the conductor track, providing a carrier having at least one electrical contact, applying an electrically conductive adhesive to the at least one accumulation of the electrically conductive material and/or the at least one electrical contact and arranging the substrate and the carrier such that the accumulation of the electrically conductive material and the at least one electrical contact are situated opposite and at a distance from one another, wherein the electrically conductive adhesive forms a mechanical and electrical connection between the accumulation of the electrically conductive material and the at least one electrical contact, and wherein an interspace between the at least one accumulation of the electrically conductive material and the at least one electrical contact is filled with the electrically conductive adhesive.

Electrical device

A device and a connection carrier are disclosed. In an embodiment a device includes a connection carrier, a frame and an encapsulation body, wherein the connection carrier, the encapsulation body and/or the frame have different thermal expansion coefficients, a semiconductor chip mechanically and electronically connected to the connection carrier and a metal layer arranged between the connection carrier and the frame, wherein the encapsulation body surrounds the semiconductor chip and is adjacent to the connection carrier and the frame, wherein the metal layer is not in electrically conductive connection, and wherein the metal layer projects beyond the frame in a lateral direction.

Device and connection carrier

A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.

Sensor

A measuring arrangement having an optical transmitter and an optical receiver are disclosed. In an embodiment a measuring arrangement includes an optical transmitter configured to transmit electromagnetic measuring radiation into a transmission space, an optical receiver configured to receive measuring radiation reflected by an object in a reception space and a covering configured to reduce reception of an interference radiation by the receiver, wherein the interference radiation is measuring radiation not reflected by the object.

Measuring arrangement having an optical transmitter and an optical receiver

A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.

Production of sensors

A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 &#x3bc;m at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.

Method of producing optoelectronic semiconductor components, and optoelectronic semiconductor component

A thin-layer encapsulation () for an optoelectronic component. The thin-layer encapsulation () comprises a sequence of layers () that comprises the following layers: a first ALD layer () deposited by means of atomic layer deposition, and a second ALD layer () deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.

Thin-layer encapsulation for an optoelectronic component, method for the production thereof, and optoelectronic component

An optoelectronic component may include: at least one layer of the optoelectronic component; at least one adhesive on the layer of the optoelectronic component; and a cover on the at least one adhesive; wherein the at least one adhesive is cured only in a partial region above at least one of a substrate and the layer.

Optoelectronic component and method for producing an optoelectronic component

An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.

Encapsulation structure for an opto-electronic component

An electronic component (), which comprises a substrate (), at least one first electrode () arranged on the substrate () and a growth layer () on the side of the electrode () remote from the substrate (), wherein the electrode () arranged on the growth layer () comprises a metal layer () with a thickness of less than or equal to 30 nm and the growth layer () has a thickness which is less than or equal to 10 nm. An electrical contact is also disclosed.

Electronic component and electrical contact

An organic light-emitting diode (), comprising a layer stack () for emitting electromagnetic radiation (). An electrically conductive first connection layer () is arranged on a first surface of the layer stack () and an electrically conductive second connection layer () at least predominantly transparent to a characteristic wavelength of the emittable electromagnetic radiation () is arranged on a second surface of the layer stack (). The organic light-emitting diode is characterized by a conductive contact structure () arranged on the opposite side of the first connection layer () from the layer stack, which contact structure is connected electrically to the second connection layer () in the region of a plurality of openings () in the first connection layer (). Also disclosed is a contact arrangement () for a two-dimensional, optically active element and to a method of producing organic light-emitting diodes ().

Organic light-emitting diode, contact arrangement and method for producing an organic light-emitting diode

A radiation-emitting arrangement comprises, in particular, a carrier element () having an at least partly non-transparent main surface () and arranged on the carrier element (), an organic radiation-emitting component () having an organic layer sequence () with an active region between an at least partly transparent first electrode () and an at least partly transparent second electrode (). The active region () is suitable for generating electromagnetic radiation () in a switched-on operating state. The radiation-emitting arrangement has a radiation exit area () for emitting the electromagnetic radiation () on that side of the organic radiation-emitting component () which faces away from the carrier element. () The at least partly non-transparent main surface () of the carrier element () is perceptible by an external observer through the radiation exit area () in a switched-off operating state of the organic radiation-emitting component ().

Growing community of inventors

Langquaid, Germany

Dirk Becker