Mosys, Inc.

Tahoe Research, Ltd.

Dipak Sikdar

Richard Stephen Roy

Jay B Patel

Rajesh Chopra

Michael J Miller

Bendik Kleveland

Michael J Morrison

Trevis Chandler

Kenneth Duong

Jung Ko

A memory device that includes an input interface that receives instructions and input data on a first plurality of serial links. The memory device includes a memory block having a plurality of banks, wherein each of the banks has a plurality of memory cells, and wherein the memory block has multiple ports. An output interface provides data on a second plurality of serial links. A cache coupled to the IO interface and to the plurality of banks, stores write data designated for a given memory cell location when the given memory cell location is currently being accessed, thereby avoiding a collision. Memory device includes one or more memory access controllers (MACs) coupled to the memory block and one or more arithmetic logic units (ALUs) coupled to the MACs. The ALUs perform one or more operations on data prior to the data being transmitted out of the IC via the IO, such as read/modify/write or statistics or traffic management functions, thereby reducing congestion on the serial links and offloading appropriate operations from the host to the memory device.

Partitioned memory with shared memory resources and configurable functions

An integrated circuit (IC) chip for transparent and in-service or production repair of single to multiple memory cell defects in a word during the datapath transit of the word between core memory to the interface of the IC via capturing an accurate bit from a word during a write access to a known defective memory address, and by substituting in a non-defective bit into the word during a read access from a known defective memory address. The IC includes: address matching circuit (CAM), a random access memory (RAM) of substitute memory cells containing accurate associated bit data and bit location in word of defect, and data selection circuitry (MUXs) coupled together.

Substitute redundant memory

A memory device includes a block of memory cells and a cache. The block of memory cells is a random access memory with multiple ports. The block of memory cells is partitioned into subunits that have only a single port. The cache is coupled to the block of memory cells adapted to handle a plurality of accesses to a same subunit of memory cells without a conflict such that the memory appears to be a random access memory to said plurality of accesses. A method of operating the memory, and a memory with bank-conflict-resolution (BCR) module including cache are also provided.

Memory with bank-conflict-resolution (BCR) module including cache

A memory device with a background built-in self-repair module (BBISRM) includes a main memory, an arbiter, and a redundant memory to repair a target memory under test (TMUT). The memory device also includes a background built-in self-test module (BBISTM) to identify portions of memory needing background built-in self-repair (BBISR). The BBISRM or the BBISTM can operate simultaneously while the memory device is operational for performing external accesses during field operation. The BBISR can detect and correct a single data bit error in the data stored in the TMUT. The arbiter configured to receive a read or write access memory request including a memory address, to determine if the memory address of the read or write access memory request matches the memory address mapped to the selected portion of the redundant memory, and to read or write data from the selected portion of the redundant memory, respectively.

Memory device with background built-in self-repair using background built-in self-testing

A memory device with background built-in self-testing (BBIST) includes a plurality of memory blocks; a memory buffer to offload data from one of the plurality of memory blocks temporarily; and a memory block stress controller to control a stress test applied to the one of the memory blocks when the data is temporarily offloaded on the memory buffer. The stress test tests for errors in the one of the plurality of the memory blocks.

Memory device with background built-in self-testing and background built-in self-repair

A memory system includes multiple (N) memory banks and multiple (M) ports, wherein N is greater than or equal to M. Each of the memory banks is coupled to each of the ports. Access requests are transmitted simultaneously on each of the ports. However, each of the simultaneous access requests specifies a different memory bank. Each memory bank monitors the access requests on the ports, and determines whether any of the access requests specify the memory bank. Upon determining that an access request specifies the memory bank, the memory bank performs an access to an array of single-port memory cells. Simultaneous accesses are performed in multiple memory banks, providing a bandwidth equal to the bandwidth of one memory bank times the number of ports. An additional level of hierarchy may be provided, which allows further multiplication of the number of simultaneously accessed ports, with minimal area overhead.

Hierarchical multi-bank multi-port memory organization

A memory system that includes a first bit line coupled to a first set of dynamic random access memory (DRAM) cells, a second (complementary) bit line coupled to a second set of DRAM cells, and a sense amplifier coupled to the first and second bit lines. The sense amplifier includes a pair of cross-coupled inverters (or a similar latching circuit) coupled between the first and second bit lines, as well as a first select transistor coupling the first bit line to a first global bit line, and a second select transistor coupling the second bit line to a second global bit line. The first and second select transistors are independently controlled, thereby enabling improved read and write access sequences to be implemented, whereby signal loss associated with bit line coupling is eliminated, 'read bump' conditions are eliminated, and late write conditions are eliminated.

Separate pass gate controlled sense amplifier

Methods for accessing DRAM cells using separate bit line control

A memory block includes a memory circuit and a clock generation unit. The memory circuit may output read data in response to being clocked by a clock signal having a selectable delay that may be dependent upon a time taken for the read data to be output by a memory core after the read command is received at the memory block. The clock generation unit may cause the read data to be provided as an output of the memory block in response to being clocked by a selected data clock signal. The data clock signal may be selected from one of several clock edges generated by one of several clock edges of a system clock such that regardless of the frequency of the system clock, the read data is provided by the memory block a predetermined amount of time after the read command is received at the memory block.

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Santa Clara, CA, United States of America

Dipak Sikdar