Analog Devices,inc.

Invensense, Inc.

Dipak Sengupta

Alain Valentin Guery

Kieran P Harney

Thomas M Goida

Brian Moss

Shrenik Deliwala

Xiaojie Xue

Jicheng Yang

Jia Gao

Manolo G Mena

Asif Chowdhury

Carlo Tiongson

Maurice S Karpman

Ying Zhao

Youn-Jae Kook

Camille L Huin

Shafi Saiyed

Yeonsung Kim

Woodrow Beckford

Richard Sullivan

William Schoppee

Rick Sullivan

Bruce Fried

An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

Integrated gesture sensor module

Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.

Packaged devices with integrated antennas

An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.

Cavity package with composite substrate

A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Microphone module with sound pipe

An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.

Integrated device packages having a MEMS die sealed in a cavity by a processor die and method of manufacturing the same

An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.

Integrated optical sensor module

Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Packages and methods for packaging

Packages and methods for packaging using a lid having multiple conductive layers

A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto. The detector module can optionally include a heat sink, which can have a top surface separated from the component substrate portion and components attached thereto by a separation gap. A computed tomography scanner can include the detector module.

Computed tomography detector module

A package for an electronic chip including an optical component protects the chip and the component, while allowing for an optical connection of the component with another optical device. This is achieved, in various embodiments, by forming a well in a protective material deposited over the chip to expose the optical component, and by providing alignment features in the protective material to align and connect the optical component with another optical device.

Optical package and related methods

Various methods are described where the semiconductor die and the lead frame (or the BGA or LGA substrate) are spaced apart to reduce stress. In one scenario, an air gap is formed between the semiconductor die and the lead frame by depositing a perimeter (made, for example, using polymer) either on the semiconductor die or the lead frame. In another scenario, an anisotropic conducting film (ACF) is formed with an air gap between the semiconductor die and the lead frame (or the BGA or LGA substrate). The air gap relieves stress on the semiconductor die. Further, a lead frame-based isolator package and a BGA (or LGA) isolator package are described. A window-frame ACF-based isolation method for magnetic coupling in a lead-frame package and BGA (or LGA) package is also described.

Stress free package and laminate-based isolator package

A cover cap for semiconductor wafer devices is disclosed. According to the invention, a wafer of material that is at least one of photo-etchable or transparent is patterned and attached as a cover to a substrate including a number of semiconductor devices. Preferably, the cover wafer is made from a photo-etchable material so that portions of the cover wafer may be selectively sensitized and etched. In particular, one or more cover caps may be defined in the cover wafer such that each cover cap corresponds to a respective device on the device substrate. Once the cover wafer is attached to the device substrate to form an assembly, the assembly is diced into individual devices and the devices are packaged. The invention provides several advantages for a number of semiconductor device fabrication applications, including those relating to image sensors, and micro-machined devices such as MEMS. For example, a cover wafer attached to the device substrate prior to dicing and packaging of individual devices provides more robust devices by protecting the device substrate from any number of environmental hazards, such as particulate contamination, moisture, processing agents such as solvents, and inadvertent scratching of the device substrate surface.

Growing community of inventors

Boxborough, MA, United States of America

Dipak Sengupta