Pacesetter, Inc.

Dion F Davis

Alvin H Weinberg

Gene A Bornzin

Gabriel A Mouchawar

John W Poore

Kevin L Morgan

Sheldon Williams

Buehl E Truex

William H Stutz, Jr

Annapurna Karicherla

Virote Indravudh

Clyde K Nason

Yong D Zhao

Charles W Markham

Grace Jang

An implantable medical lead configured for improved MRI safety and heating reduction performance is disclosed herein. In one embodiment, the lead includes a tubular body having a proximal end and a distal end with a lead connector near the proximal end. In this embodiment the lead further includes a conductor extending longitudinally within the tubular body and having a proximal end that is electrically coupled to the connector and a distal end electrically coupled to a contact pin. The lead in this embodiment further includes a filter element electrically coupled to a distal end of the contact pin and a flange electrically coupled between a proximal end of the filter element and a proximal portion of an electrode. In this embodiment the flange and the proximal portion of the electrode form at least a first part of a hermetic chamber enclosing the filter element.

Implantable medical lead configured for improved MRI safety and heating reduction performance

A body fluid pressure sensor module according to the invention comprises a housing having a first end and a second end and enclosing a pressure sensor. The pressure sensor is electrically coupled to a plurality of electrical conductors extending into the housing through a feedthrough disposed within, and hermetically sealing, the first end of the housing. The housing defines a chamber disposed between the feedthrough and the second end of the housing. The chamber contains a material in communication with the pressure sensor, the material being capable of transmitting pressure variations to the pressure sensor. The plurality of electrical conductors have ends within the housing, and the pressure sensor is mounted on the end of at least one of the conductors. Also disclosed are medical leads incorporating the pressure sensor module, and methods for fabricating the modules. The pressure sensor module is compact, and particularly so where cable conductors are utilized and the sensor is directly mounted on at least one of the cable conductors. The compactness of a pressure sensor module pursuant to the invention facilitates its incorporation into a small diameter, flexible medical lead enhancing its placement within a patient's body, for example, within the left atrium of the heart.

Pressure sensor and method of fabricating such a module

A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating 'chip-and-wire' microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.

Implantable medical device construction using a flexible substrate

A flat ribbon cable for interconnecting electrical components mounted in mating clamshell enclosure halves of an implantable cardiac stimulation device. The ribbon cable is configured to butterfly open when the enclosure is opened and interconnect components in each half without undergoing undue mechanical stress as the halves are distanced. The ribbon cable is also configured to fold together when the enclosure halves are mated together, without bending, in a very compact manner so as to occupy minimal room in the enclosure when the device is ready for implantation thus preserving more room for batteries, capacitors, and other electrical devices providing the sensing and stimulation functions of the device and/or allowing the overall space envelope of the stimulation device to be reduced.

Flexible electrical interconnect for an implantable medical device

An implantable cardiac stimulation device having an improved multi-level electronic package is disclosed. The multi-lever package includes at least two stacked internal substrates for mounting electronic circuits, a protective lid for protecting the substrates, and an external interconnect structure mounted on the lid which is also capable of mounting electronic components. The interconnection between the at least two internal substrates is achieved by vertically-oriented wirebonds, and the interconnection between at least one internal substrate and the external interconnect structure is achieved by vertically-oriented brazed-on pins which pass through holes in the protective lid. This construction minimizes the planar dimensions of the electronic package and optimizes space in the physiologically-curved portions of the housing.

Implantable medical device having an improved packaging system and

A cardiac stimulation device having a reduced volumetric configuration contains a pair of high-voltage cylindrical discharge capacitors positioned at rounded edges within a device container. The capacitors have electrical contact tabs at one end which are inserted directly through apertures formed within an associated electronic module. The capacitor tabs are connected directly to the electronic module eliminating the need for secondary connectors or point to point wiring, thus reducing the number of connections. Direct connection of the capacitors to the electronic module allows for optimal positioning of the module within the container. Specifically, the generally planar module is oriented perpendicular to planar cover surfaces of the container. Irregularly shaped components attached to the surface of the module advantageously extend away from the surface into remaining voids within the container. Adhesive compressible foam is placed around and between the internal components of the stimulation device to stabilize the device against shock and vibration.

Growing community of inventors

Acton, CA, United States of America

Dion F Davis