Pacesetter, Inc.

Dino Bortolin

Ofer Rosenzweig

Christopher R Jenney

Wisit Lim

Perry Li

Avi Bilu

Ekaterina Tkatchouk

The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

Systems and methods for manufacturing header subassembly

An implantable medical device and method are provided for implant within a patient. The device comprises a case. Radio frequency (RF) communication components are housed within the case. A header is mounted to an exterior surface of the case along an edge of the case. An antenna is coupled to the RF communication components. The antenna has an inverted E shape. The inverted E shaped antenna is within the header. The inverted E shaped antenna includes a conducting arm joined to first, second and third branches that are oriented within the header to extend toward the edge of the case underneath the header. The first branch of the antenna is conductively open and, no more than weakly coupled, with respect to the case. The second branch is located between the first and third branches. The second branch is configured to convey an RF signal feed. The third branch has a shunt to ground connection to the case. The case forms a ground plane for the antenna.

Inverted E-antenna for implantable medical devices

Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.

Implantable electronic device employing fused thermoplastic-conductor subassembly and method of manufacturing the subassembly and the device

Implementations of the present disclosure may take the form of an implantable electronic device such as an implantable pulse generator for administering electrotherapy via an implantable medical lead configured to couple with the implantable pulse generator, or an implantable cardiac monitor. The implantable electronic device includes a housing, a header connector assembly and a sealing member. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The sealing member is sandwiched between the header connector assembly and the housing.

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Camarillo, CA, United States of America

Dino Bortolin