Skyworks Solutions, Inc.

Dinhphuoc Vu Hoang

Guohao Zhang

Anthony James Lobianco

Matthew Sean Read

Hoang Mong Nguyen

Howard E Chen

Hardik Bhupendra Modi

Stephen Joseph Kovacic

Foad Arfaei Malekzadeh

Russ Alan Reisner

David Viveiros, Jr

Abdulhadi Ebrahim Abdulhadi

Jiunn-Sheng Guo

Yang Li

Xuanang Zhu

Bradley D Scoles

Anil K Agarwal

Dmitri Prikhodko

Peter J Zampardi

Robert W Warren

René Rodríguez

Thomas E Noll

Weimin Sun

Robert Francis Darveaux

Hongxiao Shao

Hsiang-Chih Sun

Jaydutt Jagdish Joshi

Bhuvaneshwaran Vijayakumar

David Steven Ripley

Philip John Lehtola

Hong Shen

Ki Wook Lee

Lori Ann DeOrio

Sandra Louise Petty-Weeks

Jens Albrecht Riege

Matthew Ozalas

Tin Myint Ko

Patrick Lawrence Welch

Yifan Guo

Mehran Janani

René Rodriguez

Dean Kazuo Enomoto

Dimitri Prikhodko

Matthew Thomas Ozalas

Reconfigurable antenna systems with ground tuning pads are provided herein. In certain embodiments, a radio frequency module includes a module substrate including a first conductive layer and a second conductive layer separated by dielectric, an antenna element formed in the first conductive layer, a plurality of tuning conductors formed in the first conductive layer, a first ground tuning pad formed in the second conductive layer and receiving a ground voltage, and a first switch. The tuning conductors include a first tuning conductor spaced apart from the antenna element on a first side of the antenna element and a second tuning conductor spaced apart from the antenna element on a second side of the antenna element. The first switch is electrically connected between the first tuning conductor and the first ground tuning pad and selectively connects the first tuning conductor to the first ground tuning pad to tune the antenna element.

Reconfigurable antenna systems with ground tuning pads

Reconfigurable antenna systems with ground tuning pads are provided herein. In certain configurations, an antenna system includes an antenna element, a first tuning conductor spaced apart from the antenna element on a first side of the antenna element, a second tuning conductor spaced apart from the antenna element on a second side of the antenna element, a first ground tuning pad configured to receive a ground voltage, and a first switch electrically connected between the first tuning conductor and the first ground tuning pad. The first switch is operable to selectively connect the first tuning conductor to the first ground tuning pad to thereby tune the antenna element.

An end-fire antenna for wideband low form factor applications includes a first metal layer, a second metal layer, and a dielectric layer disposed between the first and second metal layers. An open cavity formed in the dielectric layer that is filled with air, the cavity defined by a pair of sidewalls that extend from an aperture of the cavity to a rear wall of the cavity, where the depth of the aperture is defined between the aperture and the rear wall. The cavity is formed by selecting the width of the aperture of the cavity and the depth of the cavity such that the antenna achieves the same gain during operation irrespective of a variation in the thickness of the antenna.

Planar end fire antenna for wideband low form factor applications

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 &#x3bc;m for electromagnetic signals having frequencies in a kilohertz range.

Low frequency shield solutions with sputtered/sprayed absorber materials and/or absorber materials mixed in mold compound

A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.

Method of manufacturing a radio-frequency module with a conformal shield antenna

Reconfigurable antenna systems with ground tuning pads are provided herein. In certain configurations, an antenna system includes a module substrate including a ground plane and a ground tuning pad configured to receive a ground voltage from the ground plane. The antenna system further includes an antenna element and a tuning conductor that is spaced apart from the antenna element and operable to load the antenna element. Furthermore, a switch is electrically connected between the tuning conductor and the ground tuning pad, and operates to selectively connect the tuning conductor to the ground plane by way of the ground tuning pad to provide tuning to the antenna element.

Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

Methods of determining racetrack layout for radio frequency isolation structure

Aspects of the present disclosure relate to a packaged module with a radio frequency isolation structure that includes a racetrack, a conductive layer, and a conductive feature in an electrical path between the racetrack and the conductive layer. The racetrack can be disposed in a substrate and configured at a ground potential. The racetrack can include a break.

Radio frequency isolation structure

Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).

Semiconductor package having a metal paint layer

An antenna for radio-frequency electronics can include an end-fire antenna and a planar antenna spaced from the end-fire antenna for diversity of direction and antenna coverage. The end-fire antenna can be for wideband low form factor applications and have a first metal layer, a second metal layer, and a dielectric layer between the first and second metal layers. An open cavity formed in the dielectric layer that is filled with air, the cavity defined by a pair of sidewalls that extend from an aperture of the cavity to a rear wall of the cavity, where the depth of the aperture is defined between the aperture and the rear wall. The cavity is formed by selecting the width of the aperture of the cavity and the depth of the cavity such that the antenna achieves the same gain during operation irrespective of a variation in the thickness of the antenna.

Antenna for radio-frequency electronics

Device for electric and magnetic measurements. In some embodiments, an electrical probe can be configured to include an unshielded inner conductor at an end of a coaxial assembly to allow an electrical field to induce differential-mode currents in the coaxial assembly. In some embodiments, a magnetic probe can be configured to include a loop connected to inner and outer conductors of a coaxial assembly to induce a common mode current by a change in magnetic field flux through the loop. In some implementations, such probes can be utilized to obtain near-field measurements to facilitate applications such as electromagnetic (EM) shielding designs.

Device for electric and magnetic measurements

A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace with a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The first trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge. Further, the coupler includes a second trace, which includes a first edge substantially parallel to a second edge and substantially equal in length to the second edge. The second trace includes a third edge substantially parallel to a fourth edge. The fourth edge is divided into three segments. The outer segments are a first distance from the third edge. The middle segment is a second distance from the third edge.

Reducing coupling coefficient variation using an angled coupling trace

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Anaheim, CA, United States of America

Dinhphuoc Vu Hoang